To guarantee the reproducibility, uniformity and high yield of the fabrication results even with the unavoidable disturbances during the process, the robustness of the batch fabrication process of SThM probes has been improved. First, the shape of the hard mask used for the anisotropic tip etching was redesigned to fit to certain crystal surfaces of silicon wafer so that the sharpness of the tip is kept for a while even after the hard mask falls apart during the bulk tip etch process. Second, the aspect ratio of the tip was maximized by utilizing high concentration KOH solution. Third, the uniformity of etch rate across the wafer was improved by using ultrasonic bath during the anisotropic wet tip etching step. Through the synergistic effects of the modifications of the key steps, the tip fabrication process has become very robust and uniform. Taking advantage of the robustness of the process, we reduced the tip radius of the SThM probe down to 50 nm and the diameter of the thermocouple junction located at the end of the tip to 100 nm. As a result, the sensitivity and the spatial resolution of the new probe were demonstrated to be improved more than two times.
Skip Nav Destination
ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4390-1
PROCEEDINGS PAPER
Development of Robust Batch-Fabrication Process for High Performance SThM Probe and Quantitative Performance Evaluation
Kwangseok Hwang,
Kwangseok Hwang
Korea University, Seoul, Korea
Search for other works by this author on:
Kyeongtae Kim,
Kyeongtae Kim
Korea University, Seoul, Korea
Search for other works by this author on:
Jaehoon Chung,
Jaehoon Chung
Korea University, Seoul, Korea
Search for other works by this author on:
Ohmyoung Kwon,
Ohmyoung Kwon
Korea University, Seoul, Korea
Search for other works by this author on:
Byeonghee Lee,
Byeonghee Lee
Seoul National University, Seoul, Korea
Search for other works by this author on:
Joon Sik Lee,
Joon Sik Lee
Seoul National University, Seoul, Korea
Search for other works by this author on:
Seungho Park,
Seungho Park
Hongik University, Seoul, Korea
Search for other works by this author on:
Young Ki Choi
Young Ki Choi
Chung-Ang University, Seoul, Korea
Search for other works by this author on:
Kwangseok Hwang
Korea University, Seoul, Korea
Kyeongtae Kim
Korea University, Seoul, Korea
Jaehoon Chung
Korea University, Seoul, Korea
Ohmyoung Kwon
Korea University, Seoul, Korea
Byeonghee Lee
Seoul National University, Seoul, Korea
Joon Sik Lee
Seoul National University, Seoul, Korea
Seungho Park
Hongik University, Seoul, Korea
Young Ki Choi
Chung-Ang University, Seoul, Korea
Paper No:
MNHMT2009-18218, pp. 421-425; 5 pages
Published Online:
October 26, 2010
Citation
Hwang, K, Kim, K, Chung, J, Kwon, O, Lee, B, Lee, JS, Park, S, & Choi, YK. "Development of Robust Batch-Fabrication Process for High Performance SThM Probe and Quantitative Performance Evaluation." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 421-425. ASME. https://doi.org/10.1115/MNHMT2009-18218
Download citation file:
4
Views
0
Citations
Related Proceedings Papers
Related Articles
Effect of Fouling on Temperature Measurement Error and a Solution
J. Heat Transfer (May,1998)
Thermal Transport Mechanisms at Nanoscale Point Contacts
J. Heat Transfer (April,2002)
Related Chapters
Computer Aided Design of Tools, Dies, and Moulds (TDMs)
Computer Aided Design and Manufacturing
Design of Super-Precision Micro-Feed Tool Carrier Based on GMM
International Conference on Mechanical and Electrical Technology 2009 (ICMET 2009)
Performance Testing of Combined Cycle Power Plant
Handbook for Cogeneration and Combined Cycle Power Plants, Second Edition