Temperature variation beneath isolated bubble during saturated boiling of water was measured with a MEMS (Micro-Electro-Mechanical Systems) sensor having high temporal and spatial resolution. Then, local heat transfer from the heated surface was evaluated by a transient heat conduction analysis of the wall with measured temperature data as a boundary condition. The MEMS sensor on a 20 × 20 mm2 silicon substrate includes an electrolysis trigger and eight thin film thermocouples on the top side, and two thin film heaters on the back side. The thin film thermocouple was calibrated with a thermal scan method using two alloy samples with different melting point. The condition of the sensor was smoothly controlled with the heater. The bubble is initiated with electrolysis at a gap of the trigger electrode, where slight hydrogen gasses are supplied as bubble nuclei. Then, local and fast temperature variations in wide region are measured with the thermocouples with cutoff frequency of 100 kHz arranged in a line at 40 – 2000 μm far from the trigger gap. Measured temperature data presents formation of microlayer and expansion of dryout area in bubble growth process and rewetting in bubble departure process. The numerical analysis showed that average heat flux beneath the bubble indicated the maximum value of 19 W/cm2 during the microlayer evaporation, and then after hitting a bottom slightly lower than a heat flux at the bubble nucleation, recovers to the nucleation level. The contribution of the heat transfer from the heated wall was evaluated to approximately one-fourth of latent heat in the bubble at departure.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4390-1
PROCEEDINGS PAPER
Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor Available to Purchase
Tomohide Yabuki,
Tomohide Yabuki
Meiji University, Kawasaki, Kanagawa, Japan
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Osamu Nakabeppu
Osamu Nakabeppu
Meiji University, Kawasaki, Kanagawa, Japan
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Tomohide Yabuki
Meiji University, Kawasaki, Kanagawa, Japan
Osamu Nakabeppu
Meiji University, Kawasaki, Kanagawa, Japan
Paper No:
MNHMT2009-18244, pp. 41-47; 7 pages
Published Online:
October 26, 2010
Citation
Yabuki, T, & Nakabeppu, O. "Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 41-47. ASME. https://doi.org/10.1115/MNHMT2009-18244
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