The wettability of patterned silicon microchannels with tunable surface free energy through coating hydrophilic TiO2 nanoparticles using layer-by-layer (LbL) nano self-assembly technique is presented in this paper. Wettability of microchannels is tested by measuring the contact angle of a water droplet on the substrate. The capillary rise rate is tested by measuring the front location of liquid on the silicon microchannel surface laid on a 45 degree inclined platform. It is found that the silicon microchannels with tunable surface free energy have super-hydrophilic wettability, and demonstrate powerful capillary. For the silicon microchannels 200 μm wide, the liquid front can move up 40 mm in approximately 3 second. Fourier transformed infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) reveal the generation of -OH radicals after coating TiO2 nanoparticals, verifying that the -OH radicals have a strong effect on the hydrophilicity. The super-hydrophilic patterned microchannels suggest potential applications to microfluidic systems and heat diffusion systems based on liquid surface tension.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4389-5
PROCEEDINGS PAPER
Wetting Properties of Patterned Silicon Microchannels With Tunable Surface Energy Using Layer-by-Layer Nano Self-Assembly
Tao Zhang,
Tao Zhang
University of Minnesota, Minneapolis, MN
Search for other works by this author on:
Tianhong Cui
Tianhong Cui
University of Minnesota, Minneapolis, MN
Search for other works by this author on:
Tao Zhang
University of Minnesota, Minneapolis, MN
Tianhong Cui
University of Minnesota, Minneapolis, MN
Paper No:
MNHMT2009-18533, pp. 367-373; 7 pages
Published Online:
October 26, 2010
Citation
Zhang, T, & Cui, T. "Wetting Properties of Patterned Silicon Microchannels With Tunable Surface Energy Using Layer-by-Layer Nano Self-Assembly." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 1. Shanghai, China. December 18–21, 2009. pp. 367-373. ASME. https://doi.org/10.1115/MNHMT2009-18533
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