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Keywords: copper electroplating
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Proceedings Papers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 619-622, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70132
... electroplating current density grain diameter core cluster resistivity e E 4 Keywords: copper electroplating, current density, grain diameter, core cluster, resistivity INTRODUCTION As known, Coppe (microelectronic mecha advantages such as lowe and higher thermal excha The process conditi layer which...