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Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 597-600, June 3–5, 2008
Paper No: MicroNano2008-70111
... Anodic bonding Titanium Glass wafer-to-wafer bonding In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of coefficients of thermal expansion (CTE) match, three different types of ion-containing glasses are evaluated: Pyrex 7740, D-263T and...