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Keywords: Anodic bonding
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Proceedings Papers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 597-600, June 3–5, 2008
Paper No: MicroNano2008-70111
... Anodic bonding Titanium Glass wafer-to-wafer bonding In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of coefficients of thermal expansion (CTE) match, three different types of ion-containing glasses are evaluated: Pyrex 7740, D-263T and...
Proceedings Papers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 627-630, June 3–5, 2008
Paper No: MicroNano2008-70138
... simplified the process and solved the stickiness problem in surface micromachining. The whole fabrication temperature is under 450°C, which makes it compatible with the CMOS process. Capacitive pressure sensor SiC anodic bonding melting bonding bulk micromachining surface micromachining CMOS...
Proceedings Papers

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 265-271, January 10–13, 2007
Paper No: MNC2007-21046
... 11 06 2009 The work mainly investigates the bonding mechanism of the anodic bonding between glass and aluminium film, and bonding of multi-layers glass-Al stack is achieved by the common anode process. The SEM and EDS are applied to investigate the interfacial structure of Al-glass...