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Micro- and Nano- Thermal Transport and Integrated System Applications
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Proceedings Papers

Transport of Hydrogen Molecules in Single-Walled Carbon Nanotube

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Kyung Su Oh, DongHyun Kim, Seungho Park, Ohmyoung Kwon, Young Ki Choi, Joon Sik Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 401-403, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70248
https://doi.org/10.1115/MicroNano2008-70248
View Paper titled, Transport of Hydrogen Molecules in Single-Walled Carbon Nanotube
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Topics: Hydrogen, Single-walled carbon nanotubes, Single-walled nanotubes, Quantum mechanics, Carbon nanotubes, Containers, Density, Mass transfer, Molecular dynamics simulation, Nanoscale phenomena
Proceedings Papers

The Effects of Large Blood Vessels on Three-Dimensional Tissue Temperature Distributions During Electromagnetic Induced Nano-Hyperthermia: Numerical Simulation

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Zhong-Shan Deng, Jing Liu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 411-412, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70269
https://doi.org/10.1115/MicroNano2008-70269
View Paper titled, The Effects of Large Blood Vessels on Three-Dimensional Tissue Temperature Distributions During Electromagnetic Induced Nano-Hyperthermia: Numerical Simulation
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Topics: Biological tissues, Blood vessels, Computer simulation, Temperature distribution, Tumors, Blood, Heating, Vessels, Blood flow, Heat sinks
Proceedings Papers

Uncertainty Analysis in Bioheat Transfer Modeling for Treatment Planning of Nano-Cryosurgery

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Zhong-Shan Deng, Jing Liu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 413-414, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70270
https://doi.org/10.1115/MicroNano2008-70270
View Paper titled, Uncertainty Analysis in Bioheat Transfer Modeling for Treatment Planning of Nano-Cryosurgery
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Topics: Bioheat transfer, Modeling, Uncertainty analysis, Nanoparticles, Biological tissues, Uncertainty, Tumors, Temperature, Temperature distribution
Proceedings Papers

Rapid Electromagnetic Rewarming of Cryopreserved Tissues Using Nano-Magnetoparticles: Feasibility Study

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Zhong-Shan Deng, Jing Liu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 429-430, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70282
https://doi.org/10.1115/MicroNano2008-70282
View Paper titled, Rapid Electromagnetic Rewarming of Cryopreserved Tissues Using Nano-Magnetoparticles: Feasibility Study
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Topics: Biological tissues, Biomaterials, Heating, Cooling, Cryonics, Ice, Temperature, Vitrification, Biological cells, Convection
Proceedings Papers

Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves

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Xuegong Hu, Liyuan Wu, Dawei Tang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 395-400, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70244
https://doi.org/10.1115/MicroNano2008-70244
View Paper titled, Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves
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Topics: Bubbles, Vapors, Visualization, Microbubbles, Collapse, Heat transfer, Image processing, Matlab, Nucleate boiling, Theoretical analysis
Proceedings Papers

A DSMC Study of the Si/Ge Interface Thermal Resistance

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Mei-Jiau Huang, Dong-Jiun Tsai, Liang-Chun Liu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 455-460, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70330
https://doi.org/10.1115/MicroNano2008-70330
View Paper titled, A DSMC Study of the Si/Ge Interface Thermal Resistance
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Topics: Thermal resistance, Phonons, Simulation, Simulation results, Acoustics, Approximation, Dispersion relations, Reflection, Relaxation (Physics), Temperature
Proceedings Papers

A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films

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Tai-Ming Chang, Chien-Chou Weng, Mei-Jiau Huang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 461-466, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70331
https://doi.org/10.1115/MicroNano2008-70331
View Paper titled, A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films
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Topics: Silicon, Surface roughness, Thermal conductivity, Thin films, Temperature, Atoms, Simulation, Boundary-value problems, Computation, Evaporation
Proceedings Papers

Modeling of Light Scattering by Silica Nanoporous Structures

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Qunzhi Zhu, Yongguang Li, Dawei Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 405-409, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70260
https://doi.org/10.1115/MicroNano2008-70260
View Paper titled, Modeling of Light Scattering by Silica Nanoporous Structures
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Topics: Light scattering, Modeling, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Density, Wavelength, Nanoscale phenomena, Radiative heat transfer, Visible spectrum
Proceedings Papers

Near-Field Radiative Heat Transfer Between Materials With Dielectric Coatings

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Ceji Fu, Wenchang Tan
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 415-421, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70279
https://doi.org/10.1115/MicroNano2008-70279
View Paper titled, Near-Field Radiative Heat Transfer Between Materials With Dielectric Coatings
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Topics: Coatings, Polaritons, Radiative heat transfer
Proceedings Papers

Study for the Interface Thermal Resistance of Metal-Dielectric Layers

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Heng-Chieh Chien, Da-Jen Yao, Cheng-Ting Hsu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 423-427, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70280
https://doi.org/10.1115/MicroNano2008-70280
View Paper titled, Study for the Interface Thermal Resistance of Metal-Dielectric Layers
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Topics: Metals, Thermal resistance, Adhesion, Aluminum, Fluids, Microelectromechanical systems, Nickel, Plasma-enhanced chemical vapor deposition, Platinum, Thin films
Proceedings Papers

Analytic Solution of Gaseous Slip Heat Transfer in Micro-Channel

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Tiantian Zhang, Li Jia, Zhicheng Wang, Yan Li, Xing Li
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 355-361, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70033
https://doi.org/10.1115/MicroNano2008-70033
View Paper titled, Analytic Solution of Gaseous Slip Heat Transfer in Micro-Channel
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Topics: Heat transfer, Heating, Microchannels, Slip flow, Temperature
Proceedings Papers

Bubble Dynamics on Nanostructured Cu Surfaces

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Chen Li, Nikhil Koratkar, G. P. Peterson
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 431-436, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70296
https://doi.org/10.1115/MicroNano2008-70296
View Paper titled, Bubble Dynamics on Nanostructured Cu Surfaces
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Topics: Bubbles, Dynamics (Mechanics), Boiling, Nucleation (Physics), Visualization, Data acquisition systems, Density, Fluctuations (Physics), Fluids, Heat exchangers
Proceedings Papers

Research on Heat Transfer Characteristic of Pulsating Heat Pipe

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Yan Li, Li Jia, Tiantian Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 363-367, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70034
https://doi.org/10.1115/MicroNano2008-70034
View Paper titled, Research on Heat Transfer Characteristic of Pulsating Heat Pipe
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Topics: Heat pipes, Heat transfer
Proceedings Papers

Interactions of Liquid Plugs in a Pulsating Heat Pipe

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Wei Qu, Chong Qu, Yan Zhou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 437-441, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70315
https://doi.org/10.1115/MicroNano2008-70315
View Paper titled, Interactions of Liquid Plugs in a Pulsating Heat Pipe
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Topics: Heat pipes, Heating
Proceedings Papers

Hydrodynamic and Thermal Boundary Layers Over a Flat Plate With Slip Flow and Constant Surface Heat Flux

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Abdul Aziz
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 369-374, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70041
https://doi.org/10.1115/MicroNano2008-70041
View Paper titled, Hydrodynamic and Thermal Boundary Layers Over a Flat Plate With Slip Flow and Constant Surface Heat Flux
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Topics: Flat plates, Heat flux, Slip flow, Thermal boundary layers, Momentum, Prandtl number, Temperature, Boundary layers, Flow (Dynamics), Knudsen number
Proceedings Papers

The Model of Non-Fourier Heat Conduction in a Kind of Two-Phase Medium With Great Different Heat Conductivity

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Wen-Qiang Lu, Junfeng Lu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 375-379, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70061
https://doi.org/10.1115/MicroNano2008-70061
View Paper titled, The Model of Non-Fourier Heat Conduction in a Kind of Two-Phase Medium With Great Different Heat Conductivity
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Topics: Equilibrium (Physics), Heat, Heat conduction, Thermal conductivity
Proceedings Papers

Experimental Performance of a Nanofluid Pulsating Heat Pipe

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Wei Qu, Chong Qu, Jianchao Feng
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 443-448, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70316
https://doi.org/10.1115/MicroNano2008-70316
View Paper titled, Experimental Performance of a Nanofluid Pulsating Heat Pipe
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Topics: Heat pipes, Nanofluids, Thermal resistance
Proceedings Papers

Micro Cooling Based on Acoustic Streaming

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Hongming Sun, Hang Guo
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 381-385, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70192
https://doi.org/10.1115/MicroNano2008-70192
View Paper titled, Micro Cooling Based on Acoustic Streaming
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Topics: Acoustics, Cooling, Microchannels, Fluids, Heat transfer, Forced convection, Microfluidics, Navier-Stokes equations, Radiation (Physics), Temperature
Proceedings Papers

Effect of Operating Temperature on the Water Removal in a Polymer Electrolyte Fuel Cell

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Wanyuan Shi, Nobuyuki Oshima, L. Kumar Saha, Eru Kurihara
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 387-393, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70206
https://doi.org/10.1115/MicroNano2008-70206
View Paper titled, Effect of Operating Temperature on the Water Removal in a Polymer Electrolyte Fuel Cell
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Topics: Electrolytes, Fuel cells, Operating temperature, Polymers, Water, Gas diffusion layers, Temperature, Floods, Pressure, Steady state
Proceedings Papers

Molecular Dynamics Simulations of Heat Conduction in Thin Film With Nano-Holes

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Koji Miyazaki, Daisuke Nagai, Hiroshi Tsukamoto
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 449-454, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70327
https://doi.org/10.1115/MicroNano2008-70327
View Paper titled, Molecular Dynamics Simulations of Heat Conduction in Thin Film With Nano-Holes
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Topics: Heat conduction, Molecular dynamics simulation, Thin films, Phonons, Nanostructures , Temperature, Thermal conductivity, Boundary-value problems, Fourier transforms, Mean free path