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Proceedings Papers

PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction

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Ying Song, Hengyu Wang, Min Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 65-67, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70144
https://doi.org/10.1115/MicroNano2008-70144
View Paper titled, PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction
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Topics: Adhesion, Crystallization, Friction, Silicon
Proceedings Papers

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

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Hang Guo, Hui Yang, Liming Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 171-173, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70195
https://doi.org/10.1115/MicroNano2008-70195
View Paper titled, Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery
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Topics: Design, Manufacturing, Surgery, Displacement, Finite element methods, Microfabrication, Oscillating frequencies, Shapes, Silicon, Vibration
Proceedings Papers

Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon

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Kenneth Kollias, Hengyu Wang, Min Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 631-633, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70143
https://doi.org/10.1115/MicroNano2008-70143
View Paper titled, Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon
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Topics: Aluminum, Crystallization, Manufacturing, Silicon, Water
Proceedings Papers

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

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Gyoko Nagayama, Ryuji Ando, Kei Muramatsu, Takaharu Tsuruta
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 725-726, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70323
https://doi.org/10.1115/MicroNano2008-70323
View Paper titled, Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems
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Topics: Etching, Manufacturing, Micro fuel cells, Microelectromechanical systems, Porosity, Silicon
Proceedings Papers

Preparation of Poly(Dimethylsiloxane) Chip-Based Cartridge for Isoelectric Focusing and Whole-Channel Imaging Detection

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Junjie Ou, Shuwen Wang, Carolyn L. Ren, Janusz Pawliszyn
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 223-224, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70303
https://doi.org/10.1115/MicroNano2008-70303
View Paper titled, Preparation of Poly(Dimethylsiloxane) Chip-Based Cartridge for Isoelectric Focusing and Whole-Channel Imaging Detection
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Topics: Imaging, Plasma desorption mass spectrometry, Microfluidics, Membranes, Separation (Technology), Flow (Dynamics), Glass, Proteins, Reservoirs, Design
Proceedings Papers

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

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Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 593-596, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70079
https://doi.org/10.1115/MicroNano2008-70079
View Paper titled, Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer
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Topics: Manufacturing, Pressure sensors, Resonance, Semiconductor wafers, Silicon-on-insulator, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Silicon, Chemical etching
Proceedings Papers

A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films

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Tai-Ming Chang, Chien-Chou Weng, Mei-Jiau Huang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 461-466, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70331
https://doi.org/10.1115/MicroNano2008-70331
View Paper titled, A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films
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Topics: Silicon, Surface roughness, Thermal conductivity, Thin films, Temperature, Atoms, Simulation, Boundary-value problems, Computation, Evaporation
Proceedings Papers

Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond

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James Lee, Tony Rogers
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 107-112, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70288
https://doi.org/10.1115/MicroNano2008-70288
View Paper titled, Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond
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Topics: Low temperature, Packaging, Semiconductor wafers, Bonding, Silicon, Vacuum, Complementary metal oxide semiconductors, Damage, Electrodes, Integrated systems
Proceedings Papers

Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices

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Yinhua Lei, Wei Wang, Huaiqiang Yu, Ting Li, Yufeng Jin, Haixia Zhang, Zhihong Li
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 601-604, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70112
https://doi.org/10.1115/MicroNano2008-70112
View Paper titled, Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices
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Topics: Micromachining, Etching, Silicon, Microelectromechanical systems
Proceedings Papers

A Bulk Micromachined Cantilever Array for Uncooled Infrared Imaging

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Yuliang Yi, Shenglin Ma, Xiaomei Yu, Ming Liu, Xiaohua Liu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 131-134, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70109
https://doi.org/10.1115/MicroNano2008-70109
View Paper titled, A Bulk Micromachined Cantilever Array for Uncooled Infrared Imaging
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Topics: Cantilevers, Infrared imaging, Micromachining, Silicon, Imaging, Infrared radiation, Noise (Sound), Reactive-ion etching, Temperature, Thermomechanics
Proceedings Papers

Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging

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Shenglin Ma, Yuliang Yi, Yaquan Tang, Xiaomei Yu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 61-64, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70128
https://doi.org/10.1115/MicroNano2008-70128
View Paper titled, Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging
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Topics: Design, Infrared imaging, Manufacturing, Microelectromechanical systems, Silicon, Etching, Optimization, Thermomechanics
Proceedings Papers

Wafer Bonding Processes for the Manufacture of Microsystems

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Tony Rogers, Nick Aitken
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 705-710, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70292
https://doi.org/10.1115/MicroNano2008-70292
View Paper titled, Wafer Bonding Processes for the Manufacture of Microsystems
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Topics: Bonding, Microelectromechanical systems, Semiconductor wafers, Bond strength, Glass, Manufacturing, Packaging, Temperature, Vacuum, Acoustics
Proceedings Papers

Development and Testing of a Miniature Silicon Microgyroscope Prototype

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Dunzhu Xia, Bailing Zhou, Shourong Wang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 55-59, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70124
https://doi.org/10.1115/MicroNano2008-70124
View Paper titled, Development and Testing of a Miniature Silicon Microgyroscope Prototype
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Topics: Engineering prototypes, Microgyroscopes, Silicon, Testing, Circuits, Atmospheric pressure, Capacitors, Pressure, Q-factor, Signals
Proceedings Papers

Indentation Mechanics for Micro- and Nano-Layered Composites

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G. Tang, Y.-L. Shen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 289-294, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70038
https://doi.org/10.1115/MicroNano2008-70038
View Paper titled, Indentation Mechanics for Micro- and Nano-Layered Composites
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Topics: Composite materials, Deformation, Silicon, Tension, Aluminum, Ceramics, Computer simulation, Cracking (Materials), Diamonds, Finite element methods
Proceedings Papers

Fabrication of Suspending GAN Microstructures With Combinations of Anisotropic and Isotropic Dry Etching Techniques

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Jianan Lv, Zhenchuan Yang, Kevin J. Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 573-577, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70037
https://doi.org/10.1115/MicroNano2008-70037
View Paper titled, Fabrication of Suspending GAN Microstructures With Combinations of Anisotropic and Isotropic Dry Etching Techniques
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Topics: Anisotropy, Dry etching, Manufacturing, Gallium nitride, Etching, Reactive-ion etching, Silicon, Plasmas (Ionized gases), Scanning electron microscopes
Proceedings Papers

Investigation of Contribution Ratio Between NBTI and HC Effects in PMOSFETs Under Deep-Submicron Process

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Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, Heng-Sheng Huang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 299-304, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21082
https://doi.org/10.1115/MNC2007-21082
View Paper titled, Investigation of Contribution Ratio Between NBTI and HC Effects in PMOSFETs Under Deep-Submicron Process
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Topics: Boron, Design, Diluents, Gates (Closures), Hydrogen, Reliability, Silicon, Temperature
Proceedings Papers

Micro-Device for Rapid Separation of Suspensions for Use in Micro-Total-Analysis-Systems (μTAS)

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Ivano Gregoratto, Calum J. McNeil, Michael W. Reeks
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1079-1085, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21387
https://doi.org/10.1115/MNC2007-21387
View Paper titled, Micro-Device for Rapid Separation of Suspensions for Use in Micro-Total-Analysis-Systems (μTAS)
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Topics: Separation (Technology), Particulate matter, Flow (Dynamics), Bifurcation, Computational fluid dynamics, Microchannels, Microfabrication, Silicon
Proceedings Papers

Ion Bombardment as Dominant Factor in Plasma Cryo-Etching for High Aspect Ratio Silicon Structures

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Dejiang Lu, Zhuangde Jiang, Jiuhong Wang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 597-600, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21571
https://doi.org/10.1115/MNC2007-21571
View Paper titled, Ion Bombardment as Dominant Factor in Plasma Cryo-Etching for High Aspect Ratio Silicon Structures
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Topics: Etching, Plasmas (Ionized gases), Silicon
Proceedings Papers

A High Sensitivity Piezoresistive Pressure Sensor

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Ahsan Mian, Jesse Law
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 109-112, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21300
https://doi.org/10.1115/MNC2007-21300
View Paper titled, A High Sensitivity Piezoresistive Pressure Sensor
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Topics: Anisotropy, Diaphragms (Mechanical devices), Diaphragms (Structural), Engineering simulation, Heat conduction, Matlab, Pressure, Pressure sensors, Sensors, Silicon
Proceedings Papers

An Experimental Study of TMAH Etching Silicon for MEMS

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Feiyan Chen, Guoqing Hu, Baihai Wu
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 491-494, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21292
https://doi.org/10.1115/MNC2007-21292
View Paper titled, An Experimental Study of TMAH Etching Silicon for MEMS
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Topics: Etching, Microelectromechanical systems, Microfabrication, Semiconductor wafers, Silicon