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Proceedings Papers

Study of Package Technologies for Implantable Microdevices

Weihong Li, Zhenjiang Shi, Hang Guo, Shiqing Chen, Xiuhan Li, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 167-170, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70194
https://doi.org/10.1115/MicroNano2008-70194
View Paper titled, Study of Package Technologies for Implantable Microdevices
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Topics: Circuits, Packaging, Resonance, Silicones, Thin films
Proceedings Papers

Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond

James Lee, Tony Rogers
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 107-112, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70288
https://doi.org/10.1115/MicroNano2008-70288
View Paper titled, Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond
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Topics: Low temperature, Packaging, Semiconductor wafers, Bonding, Silicon, Vacuum, Complementary metal oxide semiconductors, Damage, Electrodes, Integrated systems
Proceedings Papers

Wafer Bonding Processes for the Manufacture of Microsystems

Tony Rogers, Nick Aitken
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 705-710, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70292
https://doi.org/10.1115/MicroNano2008-70292
View Paper titled, Wafer Bonding Processes for the Manufacture of Microsystems
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Topics: Bonding, Microelectromechanical systems, Semiconductor wafers, Bond strength, Glass, Manufacturing, Packaging, Temperature, Vacuum, Acoustics
Proceedings Papers

CMORE: Fast Track From Lab to Fab

Lou Hermans, Raffa Borzi
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 773-780, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70225
https://doi.org/10.1115/MicroNano2008-70225
View Paper titled, CMORE: Fast Track From Lab to Fab
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Topics: Complementary metal oxide semiconductors, Contamination, Failure, Flow (Dynamics), Manufacturing, Microelectromechanical systems, Packaging, Product development, Semiconductor wafers
Proceedings Papers

Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment

Zhong-Shan Deng, Jing Liu, Yi-Xin Zhou
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 463-464, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21266
https://doi.org/10.1115/MNC2007-21266
View Paper titled, Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment
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Topics: Cooling, Liquid metals, Microelectromechanical systems, Electronics, Actuators, Heat, Heat flux, Military systems, Nanoelectronics, Packaging
Proceedings Papers

Automatic Flexible Wire Bonder for MEMS Sensor Packaging Based on Zoom Lens System

Liguo Chen, Lining Sun, Lingyu Ma
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 581-586, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21545
https://doi.org/10.1115/MNC2007-21545
View Paper titled, Automatic Flexible Wire Bonder for MEMS Sensor Packaging Based on Zoom Lens System
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Topics: Lenses (Optics), Microelectromechanical systems, Packaging, Sensors, Wire, Magnification, Optical microscopes, Wire bonding, Feedback, Image segmentation
Proceedings Papers

Transition From MEMS Technology to Nanofabrication

T. Glinsner, P. Lindner, P. Kettner, H. Kirchberger
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1655-1659, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21337
https://doi.org/10.1115/MNC2007-21337
View Paper titled, Transition From MEMS Technology to Nanofabrication
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Topics: Microelectromechanical systems, Nanofabrication, Manufacturing, Semiconductor wafers, Bonding, Embossing, Lithography, Microelectronic devices, Packaging, Photolithography
Proceedings Papers

Hybrid Integration in Photosensitive Glass Using 3D Femtosecond Laser Micromachining and Its Commercial Potential

Ya Cheng, Zhizhan Xu
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1407-1416, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21365
https://doi.org/10.1115/MNC2007-21365
View Paper titled, Hybrid Integration in Photosensitive Glass Using 3D Femtosecond Laser Micromachining and Its Commercial Potential
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Topics: Lasers, Micromachining, Photochromic materials, Glass, Microfluidics, Annealing, Emission spectra, Etching, Fracture (Materials), Helium-neon lasers
Proceedings Papers

The Simple Fabrication and Packaging of Micro DMFC by MEMS Technology

Da-Jeng Yao, Yu-Chia Lai
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 785-788, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21132
https://doi.org/10.1115/MNC2007-21132
View Paper titled, The Simple Fabrication and Packaging of Micro DMFC by MEMS Technology
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Topics: Manufacturing, Micro direct methanol fuel cells, Microelectromechanical systems, Packaging, Microchannels, Glass, Fuels, Lasers, Catalysts, Damage