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Proceedings Papers

Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment

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Zhong-Shan Deng, Jing Liu, Yi-Xin Zhou
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 463-464, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21266
https://doi.org/10.1115/MNC2007-21266
View Paper titled, Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment
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Topics: Cooling, Liquid metals, Microelectromechanical systems, Electronics, Actuators, Heat, Heat flux, Military systems, Nanoelectronics, Packaging