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Proceedings Papers

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

Gyoko Nagayama, Ryuji Ando, Kei Muramatsu, Takaharu Tsuruta
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 725-726, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70323
https://doi.org/10.1115/MicroNano2008-70323
View Paper titled, Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems
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Topics: Etching, Manufacturing, Micro fuel cells, Microelectromechanical systems, Porosity, Silicon
Proceedings Papers

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 593-596, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70079
https://doi.org/10.1115/MicroNano2008-70079
View Paper titled, Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer
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Topics: Manufacturing, Pressure sensors, Resonance, Semiconductor wafers, Silicon-on-insulator, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Silicon, Chemical etching
Proceedings Papers

Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release

Ping An, Yandong He, Shitao Wang, Yanping Bai, Yilong Hao
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 677-681, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70201
https://doi.org/10.1115/MicroNano2008-70201
View Paper titled, Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release
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Topics: Accelerometers, Capacitance, Failure, Contamination, Epoxy resins, Etching, Failure analysis, Inspection, Plasmas (Ionized gases), Polishing
Proceedings Papers

Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices

Yinhua Lei, Wei Wang, Huaiqiang Yu, Ting Li, Yufeng Jin, Haixia Zhang, Zhihong Li
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 601-604, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70112
https://doi.org/10.1115/MicroNano2008-70112
View Paper titled, Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices
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Topics: Micromachining, Etching, Silicon, Microelectromechanical systems
Proceedings Papers

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

Gang Zhao, Qiong Shu, Yue Li, Jing Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 605-608, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70125
https://doi.org/10.1115/MicroNano2008-70125
View Paper titled, Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching
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Topics: Plasma etching, Titanium, Etching, Plasmas (Ionized gases), Springs, Surface roughness
Proceedings Papers

Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging

Shenglin Ma, Yuliang Yi, Yaquan Tang, Xiaomei Yu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 61-64, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70128
https://doi.org/10.1115/MicroNano2008-70128
View Paper titled, Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging
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Topics: Design, Infrared imaging, Manufacturing, Microelectromechanical systems, Silicon, Etching, Optimization, Thermomechanics
Proceedings Papers

Fabrication of Suspending GAN Microstructures With Combinations of Anisotropic and Isotropic Dry Etching Techniques

Jianan Lv, Zhenchuan Yang, Kevin J. Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 573-577, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70037
https://doi.org/10.1115/MicroNano2008-70037
View Paper titled, Fabrication of Suspending GAN Microstructures With Combinations of Anisotropic and Isotropic Dry Etching Techniques
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Topics: Anisotropy, Dry etching, Manufacturing, Gallium nitride, Etching, Reactive-ion etching, Silicon, Plasmas (Ionized gases), Scanning electron microscopes
Proceedings Papers

The Application of UV-LEDs to Microlithography

Chen-Kang Huang, Jeng-Gang Sung
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 579-582, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70055
https://doi.org/10.1115/MicroNano2008-70055
View Paper titled, The Application of UV-LEDs to Microlithography
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Topics: Light-emitting diodes, Ultraviolet radiation, Light sources, Displacement, Energy conservation, Etching, Heat sinks, Lenses (Optics), Lithography, Materials science
Proceedings Papers

The Fabrication of 16*16 MEMS-Based Optical Switch With Accurate Optical Fiber Grooves Integration

Qinghua Chen, Wengang Wu, Guizhen Yan, Yilong Hao
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 409-414, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21178
https://doi.org/10.1115/MNC2007-21178
View Paper titled, The Fabrication of 16*16 MEMS-Based Optical Switch With Accurate Optical Fiber Grooves Integration
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Topics: Manufacturing, Microelectromechanical systems, Optical fiber, Switches, Fibers, Mirrors, Rotation, Cycles, Etching, Fatigue testing
Proceedings Papers

Fabrication of Two-Dimensional Photonic Crystals on N-Type Silicon Substrate Using Holographic and Wet Etching Techniques

Han Lin, Shou Liu, Xiangsu Zhang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1315-1318, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21187
https://doi.org/10.1115/MNC2007-21187
View Paper titled, Fabrication of Two-Dimensional Photonic Crystals on N-Type Silicon Substrate Using Holographic and Wet Etching Techniques
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Topics: Chemical etching, Crystals, Manufacturing, Silicon, Etching, Dynamic light scattering, Lithography, Mass production, Periodic structures, Photoresists
Proceedings Papers

Design a System of Ar-Ion Laser Enhanced Anisotropic Etching

Dianzhong Wen
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 255-258, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21037
https://doi.org/10.1115/MNC2007-21037
View Paper titled, Design a System of Ar-Ion Laser Enhanced Anisotropic Etching
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Topics: Anisotropy, Design, Etching, Lasers, Silicon crystals
Proceedings Papers

Fabrication and Test of PECVD SiC Resonator

Yu Wang, Hui Guo, Haixia Zhang, Guobing Zhang, Zhihong Li
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 455-458, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21240
https://doi.org/10.1115/MNC2007-21240
View Paper titled, Fabrication and Test of PECVD SiC Resonator
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Topics: Manufacturing, Plasma-enhanced chemical vapor deposition, Erosion, Annealing, Circuits, Complementary metal oxide semiconductors, Electronics, Etching, High pressure (Physics), High temperature
Proceedings Papers

Bubble Based Micro/Nano Fabrication Method

Xiao-Dan Bai, Jing Liu
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 71-81, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21246
https://doi.org/10.1115/MNC2007-21246
View Paper titled, Bubble Based Micro/Nano Fabrication Method
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Topics: Bubbles, Nanofabrication, Manufacturing, Nanostructures , Chemical reactions, Blocks (Building materials), Bridges (Structures), Etching, Membranes, Nanowires
Proceedings Papers

Ion Bombardment as Dominant Factor in Plasma Cryo-Etching for High Aspect Ratio Silicon Structures

Dejiang Lu, Zhuangde Jiang, Jiuhong Wang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 597-600, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21571
https://doi.org/10.1115/MNC2007-21571
View Paper titled, Ion Bombardment as Dominant Factor in Plasma Cryo-Etching for High Aspect Ratio Silicon Structures
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Topics: Etching, Plasmas (Ionized gases), Silicon
Proceedings Papers

A Low Temperature, Non-Aggressive Wafer Level Hermetic Package With UV Cured SU8 Bond

Yexian Wu, Guanrong Tang, Jing Chen
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1523-1526, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21528
https://doi.org/10.1115/MNC2007-21528
View Paper titled, A Low Temperature, Non-Aggressive Wafer Level Hermetic Package With UV Cured SU8 Bond
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Topics: Low temperature, Semiconductor wafers, Ultraviolet radiation, Adhesives, Microelectromechanical systems, Aluminum, Bonding, Cavities, Coating processes, Coatings
Proceedings Papers

An Experimental Study of TMAH Etching Silicon for MEMS

Feiyan Chen, Guoqing Hu, Baihai Wu
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 491-494, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21292
https://doi.org/10.1115/MNC2007-21292
View Paper titled, An Experimental Study of TMAH Etching Silicon for MEMS
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Topics: Etching, Microelectromechanical systems, Microfabrication, Semiconductor wafers, Silicon
Proceedings Papers

Hybrid Integration in Photosensitive Glass Using 3D Femtosecond Laser Micromachining and Its Commercial Potential

Ya Cheng, Zhizhan Xu
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1407-1416, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21365
https://doi.org/10.1115/MNC2007-21365
View Paper titled, Hybrid Integration in Photosensitive Glass Using 3D Femtosecond Laser Micromachining and Its Commercial Potential
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Topics: Lasers, Micromachining, Photochromic materials, Glass, Microfluidics, Annealing, Emission spectra, Etching, Fracture (Materials), Helium-neon lasers
Proceedings Papers

A Si 3 N 4 Tube Formed Using TMAH Etching

Huijun Chen, Dacheng Zhang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 65-70, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21245
https://doi.org/10.1115/MNC2007-21245
View Paper titled, A Si 3 N 4 Tube Formed Using TMAH Etching
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Topics: Anisotropy, Etching
Proceedings Papers

Fabrication of Nano-Electromechanical Structures Down to 20 nm by Spacer Technology

Xiang Han, Ling Xia, Wengang Wu, Guizhen Yan, Jun Xu, Yilong Hao
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 403-407, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21174
https://doi.org/10.1115/MNC2007-21174
View Paper titled, Fabrication of Nano-Electromechanical Structures Down to 20 nm by Spacer Technology
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Topics: Anisotropy, Cantilever beams, Damage, Density, Dimensions, Electroless plating, Etching, Film thickness, Lithography, Manufacturing