Molecular dynamics (MD) simulation method is used to simulate the thermophysical properties of nanofluids: thermal conductivity and viscosity. This paper reports a better agreement between present numerical results and experimental data. It shows MD to be an effective method to forecast some thermal properties of nanofluids. Many former experiments have shown that this new heat transfer fluids - nanofluids can greatly enhance the heat-transfer efficiency. This work further gives the effects of the volume fraction and the size of nanoparticles on the thermal conductivity and the viscosity of nanofluids. Numerical results show that, decreasing size of nanoparticle or increasing the volume fraction can increase thermal conductivity with increasing viscosity; for suitable volume fraction and size, increasing viscosity with improving heat transfer capability is acceptable.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Molecular Dynamical Study on the Nanoscale Effect of Particles on the Thermal Conductivity and Viscosity in Nanofluids
Wen-Qiang Lu,
Wen-Qiang Lu
Chinese Academy of Sciences, Beijing, China
Search for other works by this author on:
Qing-Mei Fan
Qing-Mei Fan
Chinese Academy of Sciences, Beijing, China
Search for other works by this author on:
Wen-Qiang Lu
Chinese Academy of Sciences, Beijing, China
Qing-Mei Fan
Chinese Academy of Sciences, Beijing, China
Paper No:
MNC2007-21438, pp. 887-895; 9 pages
Published Online:
June 8, 2009
Citation
Lu, W, & Fan, Q. "Molecular Dynamical Study on the Nanoscale Effect of Particles on the Thermal Conductivity and Viscosity in Nanofluids." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 887-895. ASME. https://doi.org/10.1115/MNC2007-21438
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