Unsteady heat conduction is known to deviate significantly from Fourier’s law when the system time and length scales are within certain temporal and spatial windows of relaxation. Classical molecular dynamics simulations were used to investigate unsteady heat conduction in argon thin films with a sudden temperature increase at one surface to study the non-Fourier heat conduction effects in argon thin films. The studies were conducted with both pure argon films and films with vacancy defects. The temperature profiles in the argon films showed the wave nature of heat propagation. Comparisons of the MD temperature profiles with the temperature profiles from Fourier’s law conduction show that Fourier’s law is not able to predict the temperature development with the time. Different film thicknesses were also studied to illustrate the variation of the time needed for the films to reach steady-state temperature profiles, which means that the relaxation time varies with film thickness.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Molecular Dynamics Simulation of Non-Fourier Heat Conduction
Qi-Xin Liu,
Qi-Xin Liu
Tsinghua University, Beijing, China
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Pei-Xue Jiang,
Pei-Xue Jiang
Tsinghua University, Beijing, China
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Heng Xiang
Heng Xiang
Tsinghua University, Beijing, China
Search for other works by this author on:
Qi-Xin Liu
Tsinghua University, Beijing, China
Pei-Xue Jiang
Tsinghua University, Beijing, China
Heng Xiang
Tsinghua University, Beijing, China
Paper No:
MNC2007-21151, pp. 801-806; 6 pages
Published Online:
June 8, 2009
Citation
Liu, Q, Jiang, P, & Xiang, H. "Molecular Dynamics Simulation of Non-Fourier Heat Conduction." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 801-806. ASME. https://doi.org/10.1115/MNC2007-21151
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