The simulation of the forced convection heat transfer occurring in a microchannel heat sink with unitary circular flow and short distance heat transfer is presented. The temperature and velocity distributions of the coolant in the microchannels under the different flow rates were performed using the commercial FE software package [ANSYS]. The lowest flow rate satisfying the maximum operating temperature of the electronic device is 2ml/min with the input heat flux 25W/cm2. The temperature difference along flow direction in the lognitudinal channel with the transverse channel arrays is reduced compared with the traditional parallel channel structure. A uniform temperature distribution and high heat transfer efficiency are developed.

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