In present study, equal channel angular pressing (ECAP) of a quenched commercially pure titanium (CP-Ti) (grade 2) has been successfully performed at 723 K with an imposed equivalent normal strain of about ∼0.5, and its tensile properties and dislocation strengthening was investigated. A high yield strength of ∼680 MPa (36% higher than that of the unECAPed CP-Ti) in terms of CP-Ti has been observed. In addition to the strengthening, this processing allows the ECAPed CP-Ti have a high level of tensile ductility (∼30%). The dislocation strengthening contribution was estimated by using Taylor equation, where the dislocation density was calculated in terms of the value of the coherent diffraction domain size and the lattice micro-strain, which were obtained from XRD line broadening analysis. This theoretical analysis illustrates that ECAP-resulted dislocation make a strengthening contribution of about ∼34.9% for the improvement in strength.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Tensile Properties and Dislocation Strengthening of CP-Ti Processed by Equal-Channel Angular Pressing at 723K
Xiaojing Xu,
Xiaojing Xu
Jiangsu University, Zhenjiang, China
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Xuefeng Zhang,
Xuefeng Zhang
Jiangsu University, Zhenjiang, China
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Kangmin Chen,
Kangmin Chen
Jiangsu University, Zhenjiang, China
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Li Pan
Li Pan
Jiangsu University, Zhenjiang, China
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Xiaojing Xu
Jiangsu University, Zhenjiang, China
Xuefeng Zhang
Jiangsu University, Zhenjiang, China
Jinqi Cao
Jiangsu University, Zhenjiang, China
Kangmin Chen
Jiangsu University, Zhenjiang, China
Li Pan
Jiangsu University, Zhenjiang, China
Paper No:
MNC2007-21325, pp. 669-672; 4 pages
Published Online:
June 8, 2009
Citation
Xu, X, Zhang, X, Cao, J, Chen, K, & Pan, L. "Tensile Properties and Dislocation Strengthening of CP-Ti Processed by Equal-Channel Angular Pressing at 723K." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 669-672. ASME. https://doi.org/10.1115/MNC2007-21325
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