A method of incorporating research is proposed on scratching and uniaxial tension based on molecular dynamics (MD) with embodied atom method (EAM) for single copper in this paper. The process of tri-pyramid diamond tool scratching the single copper on the (010) plane is simulated under different penetrated depths. The details of scratching process and uniaxial tension are depicted in atomic view. The phenomena of heal-up surface, dislocations and burr are shown after the workpiece is scratched and the principle of that is attempted to analyze. The defects of the surface and subsurface of the workpiece scratched are represented and analyzed by the perspective of dislocations and radial distribution function (RDF). Whereafter the uniaxial tensile simulation of the “real” workpiece after scratching is performed. The mechanism of deformation and the details of change under the uniaxial load are analysed through the stress-strain curve that is combined with the perspective of atom. From simulations results, it is found that the dislocations only occur on the surface and subsurface of workpiece at the small scratching depth, while the dislocations are nucleated and emitted in front of tool and beneath the tool under the deep scratching depth. Dislocations disappear when they propagate to the surface. After the tool escapes the workpiece, the atoms on surface of the workpiece scratched heal up to some extent by the inter force of atoms, while some of the pile-up atoms on surface of tool are attracted backwards surface of workpiece, then form the burr, and others of those atoms are absorbed on the tool’s surface. The number of defects from surface and inner of workpiece increase when the scratching depth is doubled. The order of crystal decreases, especially long range order. It is shown that the penetration depth into the workpiece during scratching affects both surface pile-up and residual defect generation that is important in assessing the change of material properties after being scratched. In the process of the simulation of uniaxial load, the yield stress decrease with the increasing depth of cutting, and dislocations are nucleated at the bottom of groove, especially at the position where the tool escaped nearby burr firstly, and dislocations at ∼45° are observed. It shows that groove is the source of the dislocations aroused. The break-up point is near to the middle of workpiece with increasing depth with groove.
Skip Nav Destination
2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Incorporate Research on Scratching and Uniaxial Tension of Three-Dimensional Microconstruction Simulation Based on Molecular Dynamic Available to Purchase
Yingchun Liang,
Yingchun Liang
Harbin Institute of Technology, Harbin, China
Search for other works by this author on:
Jiaxuan Chen,
Jiaxuan Chen
Harbin Institute of Technology, Harbin, China
Search for other works by this author on:
Qingshun Bai,
Qingshun Bai
Harbin Institute of Technology, Harbin, China
Search for other works by this author on:
Yulan Tang,
Yulan Tang
Shenang Jianzhu University, Shenyang, China
Search for other works by this author on:
Mingjun Chen
Mingjun Chen
Harbin Institute of Technology, Harbin, China
Search for other works by this author on:
Yingchun Liang
Harbin Institute of Technology, Harbin, China
Jiaxuan Chen
Harbin Institute of Technology, Harbin, China
Qingshun Bai
Harbin Institute of Technology, Harbin, China
Yulan Tang
Shenang Jianzhu University, Shenyang, China
Mingjun Chen
Harbin Institute of Technology, Harbin, China
Paper No:
MNC2007-21258, pp. 655-659; 5 pages
Published Online:
June 8, 2009
Citation
Liang, Y, Chen, J, Bai, Q, Tang, Y, & Chen, M. "Incorporate Research on Scratching and Uniaxial Tension of Three-Dimensional Microconstruction Simulation Based on Molecular Dynamic." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 655-659. ASME. https://doi.org/10.1115/MNC2007-21258
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Hydrogen-reduced dislocation line tension in fcc nickel
J. Appl. Mech (January,0001)
High Temperature Tensile and Compressive Behaviors of Nanostructured Polycrystalline AlCoCrFeNi High Entropy Alloy: A Molecular Dynamics Study
J. Eng. Mater. Technol (April,2024)
On the Strain Saturation Conditions for Polycrystalline Ferroelastic Materials
J. Appl. Mech (July,2003)
Related Chapters
A 3D Cohesive Modelling Approach for Hydrogen Embrittlement in Welded Joints of X70 Pipeline Steel
International Hydrogen Conference (IHC 2012): Hydrogen-Materials Interactions
Molecular Dynamics and Mesoscopic Simulation for the Miscibility of Polypropylene/Polyamide-11 Blends
International Conference on Information Technology and Computer Science, 3rd (ITCS 2011)
Detailed Study of the Tensile Behavior of a Two-Dimensionally Woven Nicalon™/Sylramic™ Ceramic Matrix Composite
Mechanical, Thermal and Environmental Testing and Performance of Ceramic Composites and Components