A novel MEMS hollow microneedle array is fabricated through the exposure technique in deep X-ray lithography and development procedure in this paper. The method to fabricate microneedle array presented in this paper needn’t any special apparatuses, and is very easy to operate. A method to compensate the beam distribution of synchrotron radiation light source is described. The PMMA (polymethylmethacrylate) sheet is chosen as the material of microneedle. The length of the hollow microneedle fabricated is 160μ m. The outer diameter of microneedle is 80μm, and the inner diameter of microneedle is 40μm. The mechanical characters of microneedle, such as the force withstanding capabilities, are studied through both the theoretical analysis and numerical simulation of finite element method. The analysis results of the mechanical character show that the strength of microneedles fabricated in this paper is enough to pierce human skin.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Study on Novel MEMS Hollow Microneedle Array
Shuhai Jia
,
Shuhai Jia
Xi’an Jiaotong University, Xi’an, Shaanxi, China
Search for other works by this author on:
Yigui Li
,
Yigui Li
Shanghai Jiaotong University, Shanghai, China
Search for other works by this author on:
Xiao Sun
,
Xiao Sun
Xi’an Jiaotong University, Xi’an, Shaanxi, China
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Jun Zhu
Jun Zhu
Shanghai Jiaotong University, Shanghai, China
Search for other works by this author on:
Shuhai Jia
Xi’an Jiaotong University, Xi’an, Shaanxi, China
Yigui Li
Shanghai Jiaotong University, Shanghai, China
Xiao Sun
Xi’an Jiaotong University, Xi’an, Shaanxi, China
Jun Zhu
Shanghai Jiaotong University, Shanghai, China
Paper No:
MNC2007-21415, pp. 539-542; 4 pages
Published Online:
June 8, 2009
Citation
Jia, S, Li, Y, Sun, X, & Zhu, J. "Study on Novel MEMS Hollow Microneedle Array." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 539-542. ASME. https://doi.org/10.1115/MNC2007-21415
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