This paper describes new test method for obtaining static and dynamic characteristics of thin film and reliability evaluation method on MEMS device with thin film. The Su-8 is often used in micro-electro-mechanical systems devices. Durability should be ensured for such devices under cycling load. Therefore, with the proposed specimen and test procedure, tensile test was performed to obtain mechanical properties. The specimen was made with dimensions of 1000μm long, 9 and 11 μm thickness, and 3 kinds of width, 50, 100 and 150μm. Behaviors of Su-8 have the 3 kinds of stress-strain curves. The mechanical characteristics of Su-8 were multiple, showing characteristics of brittle and ductile material and polymer. It was found that the mechanical properties of Su-8 did not have any effect on thickness. High cycle fatigue test was performed to obtain probability of failure at a given stress. We found that fatigue life of Su-8 was very susceptible to stress level and then strength-stress model was suitable for the assessment of durability of MEMS structure under cycling load.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Reliability Assessment of MEMS Structure of Su-8 Thin Film
Jun-Hyub Park,
Jun-Hyub Park
TongMyong University, Pusan, South Korea
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Joong-Hyok An,
Joong-Hyok An
Korea University, Seoul, South Korea
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Yun-Jae Kim,
Yun-Jae Kim
Korea University, Seoul, South Korea
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Hak-Joo Lee,
Hak-Joo Lee
Korea Institute of Machinery and Materials, Daejeon, South Korea
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Hee Yuel Roh,
Hee Yuel Roh
Samsung Electronics Company, Ltd., Suwon, Kyunggi, South Korea
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Sang-Hyun Kim
Sang-Hyun Kim
Samsung Advanced Institute of Technology, Suwon, Kyunggi, South Korea
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Jun-Hyub Park
TongMyong University, Pusan, South Korea
Joong-Hyok An
Korea University, Seoul, South Korea
Yun-Jae Kim
Korea University, Seoul, South Korea
Hak-Joo Lee
Korea Institute of Machinery and Materials, Daejeon, South Korea
Hee Yuel Roh
Samsung Electronics Company, Ltd., Suwon, Kyunggi, South Korea
Sang-Hyun Kim
Samsung Advanced Institute of Technology, Suwon, Kyunggi, South Korea
Paper No:
MNC2007-21306, pp. 495-500; 6 pages
Published Online:
June 8, 2009
Citation
Park, J, An, J, Kim, Y, Lee, H, Roh, HY, & Kim, S. "Reliability Assessment of MEMS Structure of Su-8 Thin Film." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 495-500. ASME. https://doi.org/10.1115/MNC2007-21306
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