Testing the MEMS Device’s Internal Structure Topography Based on Transmission and Interference Technique

Based on the principle of white light interference with the Micro System Analyzer ( MSA400 ), the sample of the comb bonded silicon with glass from the Peking University is investigated. In the experiment, the light can transmit through the glass and interfere. Through analyzing the changes of the interference stripes and using the method of envelope to deal with the result, the internal structure of the MEMS can be shown and its geometry dimension and 3D topography can be measured with the testing exposure time 1/250s and 1/300s respectively. From the analyses, the depth of the groove constituted by the combs of the resonator is 84.43um, the width 10um and the depth-to-width ratio 8:1.