A high g accelerometer based on Silicon-On-Insulator (SOI) piezoresistive material with cantilever beam is described, which can measure the acceleration up to 105 g. The excellent electrical and mechanical properties of SOI material may be suitable in the applications of the high-g force accelerometer as an electromechanical sensor. One kind of SOI Wheatstone bridge strain silicon gauge is developed, and the size of the SOI silicon gauge is 1.8mm×1.6mm×0.2mm. A kind of cantilever beam structure is designed to endure the impact of high-g acceleration. The SOI silicon gauge is bonded on the cantilever beam by the way of AuSn eutectic. The fabricated devices have been subjected to shock tests up to 105 g by using a Hopkinson’s bar, the resonance frequency of which may be up to 40 kHz. The design modeling procedures and results are reported and the fabrication steps are described.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
A High G Accelerometer Based on SOI Piezoresistive Material With Cantilever Beam
Yulong Zhao,
Yulong Zhao
Xi’an Jiaotong University, Xi’an, China
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Libo Zhao,
Libo Zhao
Xi’an Jiaotong University, Xi’an, China
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Jianzhong Gao,
Jianzhong Gao
Xi’an Jiaotong University, Xi’an, China
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Zhuangde Jiang
Zhuangde Jiang
Xi’an Jiaotong University, Xi’an, China
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Yulong Zhao
Xi’an Jiaotong University, Xi’an, China
Libo Zhao
Xi’an Jiaotong University, Xi’an, China
Jianzhong Gao
Xi’an Jiaotong University, Xi’an, China
Zhuangde Jiang
Xi’an Jiaotong University, Xi’an, China
Paper No:
MNC2007-21518, pp. 143-147; 5 pages
Published Online:
June 8, 2009
Citation
Zhao, Y, Zhao, L, Gao, J, & Jiang, Z. "A High G Accelerometer Based on SOI Piezoresistive Material With Cantilever Beam." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 143-147. ASME. https://doi.org/10.1115/MNC2007-21518
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