In electro discharge machining (EDM) for 3D micro structures, the electrode wear is serious and it needs to be compensated in process. To obtain a better balance of the machining accuracy and efficiency, a servo scanning EDM method is proposed for 3D micro structures, in which the electrode wear is compensated on real-time by controlling the discharge gap constant. It is supposed reasonably that the machining depth of each layer in servo scanning EDM is consistent if discharge gap is kept preferably. The servo scanning EDM strategies include the model design by Pro/Engineer (Pro/E), the plan and simulation of scanning path, and the machining process. The 3D micro structures are machined by scanning layer-by-layer under servo control of the electrode with monitoring discharge gap signal. The CAM, gap servo control, and real-time electrode wear compensating are integrated into the machining system. The evaluation experiments of servo scanning EDM and the typical machining experiments of 3D micro structures have been carried out. The machining results show that the electro discharge in the servo scanning EDM is more stable. Servo scanning micro EDM is propitious to improve machining accuracy and efficiency in 3D micro structures.
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2007 First International Conference on Integration and Commercialization of Micro and Nanosystems
January 10–13, 2007
Sanya, Hainan, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4265-7
PROCEEDINGS PAPER
Servo Scanning EDM for 3D Micro Structures
Hao Tong,
Hao Tong
Harbin Institute of Technology, Harbin, China
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Yang Wang
Yang Wang
Harbin Institute of Technology, Harbin, China
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Yong Li
Tsinghua University, Beijing, China
Hao Tong
Harbin Institute of Technology, Harbin, China
Jing Cui
Tsinghua University, Beijing, China
Yang Wang
Harbin Institute of Technology, Harbin, China
Paper No:
MNC2007-21262, pp. 1369-1374; 6 pages
Published Online:
June 8, 2009
Citation
Li, Y, Tong, H, Cui, J, & Wang, Y. "Servo Scanning EDM for 3D Micro Structures." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 1369-1374. ASME. https://doi.org/10.1115/MNC2007-21262
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