Wire saw, with its ability to cut hard brittle material, such as silicon ingots, crystals and quartz, has emerged as a leading technology for production in semiconductor and photovoltaic industry. There are some defects in conventional loose abrasive wire saw such as significant industrial waste, low machining efficiency, high running costs, etc. As a countermeasure to these problems, some fixed-abrasive diamond wire saws are produced by electroplating process, bonding with resin agent or mechanical embedding of abrasive grains into piano wires. Nevertheless, there still exist disadvantages such as low efficiency of bonding process and high manufacture cost. For this reason, in the research, an idea of making fixed-abrasive diamond wire saw bonded with ultraviolet-curing resin is proposed. In manufacture process, generally, the preparation of materials, improvement of adhesion, and the art of ultraviolet curing determine what technologies is most effective. Therefore, to attain a specific set of properties in the cured wire saw and to achieve an efficient ultraviolet-curing process, the factors that influence the photopolymerization should be well understood. In this paper, the manufacturing process of an ultraviolet-curing resin wire saw is illustrated. Moreover, slicing experiments are deduced to evaluate the results of the study.

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