There is a lack of fundamental understanding of micro-end-milling of silicon wafer, specifically basic understanding of material removal mechanism, cutting forces and machined surface integrity in micro scale machining of silicon. It is necessary to determine the forces generated during the cutting operation due to chip thickness along with tool geometry, tool material properties and workpiece properties because cutting forces will provide vital information for the design, modeling and control of the machining process. In this study, cutting force data can be used to determine cutting regime machining of silicon wafer.
- Nanotechnology Institute
Cutting Force Analysis to Determine the Performance of Micro End Milling Process of Silicon Wafer
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Rusnaldy, , Ko, TJ, & Kim, HS. "Cutting Force Analysis to Determine the Performance of Micro End Milling Process of Silicon Wafer." Proceedings of the 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B. Sanya, Hainan, China. January 10–13, 2007. pp. 1131-1135. ASME. https://doi.org/10.1115/MNC2007-21005
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