An abnormal capacitance case of capacitive accelerometer after inductive coupled plasma (ICP) release was investigated to solve the failure problem. scanning electron microscopy (SEM)/transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDX), X-Ray transmission inspection, epoxy resin filling/polishing were used to identify the possible root cause. Failure analysis results confirmed that abnormal capacitance occurred by some connecting combs. Based on the results of three ways to analysis, it was concluded that the abnormal capacitance was not due to the contamination between combs of accelerometer and the substrate, but due to the connection between some combs caused by the ICP etching ununiformity. The static capacitance and resistance test results also testified this conclusion.
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2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release
Shitao Wang,
Shitao Wang
Peking University, Beijing, China
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Yanping Bai,
Yanping Bai
Peking University, Beijing, China
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Yilong Hao
Yilong Hao
Peking University, Beijing, China
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Ping An
Peking University, Beijing, China
Yandong He
Peking University, Beijing, China
Shitao Wang
Peking University, Beijing, China
Yanping Bai
Peking University, Beijing, China
Yilong Hao
Peking University, Beijing, China
Paper No:
MicroNano2008-70201, pp. 677-681; 5 pages
Published Online:
June 12, 2009
Citation
An, P, He, Y, Wang, S, Bai, Y, & Hao, Y. "Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 677-681. ASME. https://doi.org/10.1115/MicroNano2008-70201
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