Isolation is usually a key factor that requires serious considerations in developing an integrated MEMS device. Here a deep trench refilling technology with parylene C was proposed to get high-quality isolation performance in bulk micro-machined devices. A 7μm wide and 50μm deep trench was etched on silicon and then refilled with parylene C to work as the functional component. A multi-step etching-refilling process was tested to improve the refilling performance. Based on primary experimental results, the trench was nearly filled by parylene C with a keyhole width less than 1.0μm. Combined with a backside slicing/etching process, the suspended trench exhibited an excellent mechanical connection performance with a breaking strength larger than 200 kPa. The present parylene C refilling technique could be a promising choice for both electrical and thermal isolation in bulk micromachined silicon devices.
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2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices
Huaiqiang Yu,
Huaiqiang Yu
Peking University, Beijing, China
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Haixia Zhang,
Haixia Zhang
Peking University, Beijing, China
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Zhihong Li
Zhihong Li
Peking University, Beijing, China
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Yinhua Lei
Peking University, Beijing, China
Wei Wang
Peking University, Beijing, China
Huaiqiang Yu
Peking University, Beijing, China
Ting Li
Peking University, Beijing, China
Yufeng Jin
Peking University, Beijing, China
Haixia Zhang
Peking University, Beijing, China
Zhihong Li
Peking University, Beijing, China
Paper No:
MicroNano2008-70112, pp. 601-604; 4 pages
Published Online:
June 12, 2009
Citation
Lei, Y, Wang, W, Yu, H, Li, T, Jin, Y, Zhang, H, & Li, Z. "Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 601-604. ASME. https://doi.org/10.1115/MicroNano2008-70112
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