The chip size, substrate material and package type of ICs are continuously changed due to the advanced process development. In order to satisfy these needs, it is necessary to cut wafers as discrete chip shape. Recently, the cutting technology cardinally relies on the thinner diamond blade plus some variable dicing saw parameters to obtain the separate chips. Although the cutting process is similar to that with traditional mechanical cutting, the accuracy and the quality are totally different. The previous is better than the last. Therefore, the cutting cost is not easily reduced more, except promoting the cutting yield. At the same time, if the utility rate of the cutting machine in one day is increased, this is an alternative to possibly decrease the cost. In present and commercial species of cutting machine, there are single cut, double cut, and laser cut. Except some advanced products or special wafers with laser cut method, most of commercial ICs are still cut with single-cut machine. In this study, we investigate the recent wafer cutting methods and how to protect the pad quality on ICs and probably decrease the assembly price. During this effort, we expect that one is to increase the cutting yield and the other is to practically reduce the assembly-line cost.
Skip Nav Destination
Close
Sign In or Register for Account
2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
Investigation of Dicing Saw Methods Impacting Back-End Assembly Process
Mu-Chun Wang
,
Mu-Chun Wang
Ming Hsin University of Science & Technology, Hsin-Chu; National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Search for other works by this author on:
Zhen-Ying Hsieh
,
Zhen-Ying Hsieh
National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Search for other works by this author on:
Kuo-Shu Huang
,
Kuo-Shu Huang
Ming Hsin University of Science & Technology, Hsin-Chu; Generalplus Technology Inc., Hsinchu, Taiwan, R.O.C.
Search for other works by this author on:
Shuang-Yuan Chen
,
Shuang-Yuan Chen
National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Search for other works by this author on:
Heng-Sheng Huang
Heng-Sheng Huang
National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Search for other works by this author on:
Mu-Chun Wang
Ming Hsin University of Science & Technology, Hsin-Chu; National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Zhen-Ying Hsieh
National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Kuo-Shu Huang
Ming Hsin University of Science & Technology, Hsin-Chu; Generalplus Technology Inc., Hsinchu, Taiwan, R.O.C.
Shuang-Yuan Chen
National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Heng-Sheng Huang
National Taipei University of Technology, Taipei, Taiwan, R.O.C.
Paper No:
MicroNano2008-70015, pp. 563-567; 5 pages
Published Online:
June 12, 2009
Citation
Wang, M, Hsieh, Z, Huang, K, Chen, S, & Huang, H. "Investigation of Dicing Saw Methods Impacting Back-End Assembly Process." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 563-567. ASME. https://doi.org/10.1115/MicroNano2008-70015
Download citation file:
- Ris (Zotero)
- Reference Manager
- EasyBib
- Bookends
- Mendeley
- Papers
- EndNote
- RefWorks
- BibTex
- ProCite
- Medlars
Close
Sign In
7
Views
0
Citations
Related Proceedings Papers
Related Articles
Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
J. Eng. Mater. Technol (October,2012)
Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads
J. Manuf. Sci. Eng (May,1998)
Related Chapters
Integration of PDM, ERP and MES through Single Source of Product Data for Product Design and Development
International Conference on Advanced Computer Theory and Engineering (ICACTE 2009)
On the Design of a Sustainable Production Line: The MetaCAM Tool
Advances in Multidisciplinary Engineering
An Integrated Approach to the Planning of Manual Assembly Lines
Advances in Multidisciplinary Engineering