Microfluidics is both a science and a technology that offers great and perhaps even revolutionary capabilities to impact the society in the future. Polydimethylsiloxane (PDMS) has been widely used in fabricating microfluidic systems but few attentions were paid in the past to mechanical properties of PDMS. Very importantly there is no report on influences of microfabrication processes which normally involve chemical reaction processes. A comprehensive investigation was made by authors to study fundamental issues regarding chemical emersion and their effects on mechanical properties of PDMS. Results shown in this work can be used to guide future developments of microfluidics in utilizing PDMS especially those devices involve actuation of PDMS membranes.
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2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
Mechanical Properties of PDMS Membrane and Influences of Commonly Used Chemicals in Microfabrication
Miao Liu,
Miao Liu
University of Central Florida, Orlando, FL
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Jianren Sun,
Jianren Sun
University of Central Florida, Orlando, FL
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Ying Sun,
Ying Sun
University of Central Florida, Orlando, FL
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Quanfang Chen
Quanfang Chen
University of Central Florida, Orlando, FL
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Miao Liu
University of Central Florida, Orlando, FL
Jianren Sun
University of Central Florida, Orlando, FL
Ying Sun
University of Central Florida, Orlando, FL
Quanfang Chen
University of Central Florida, Orlando, FL
Paper No:
MicroNano2008-70343, pp. 551-556; 6 pages
Published Online:
June 12, 2009
Citation
Liu, M, Sun, J, Sun, Y, & Chen, Q. "Mechanical Properties of PDMS Membrane and Influences of Commonly Used Chemicals in Microfabrication." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 551-556. ASME. https://doi.org/10.1115/MicroNano2008-70343
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