A novel, versatile concept of micromachines has been developed to measure the mechanical response of films, beams or tubes, with thickness ranging between 10 to 1000 nm. Its capacity to study large strains and fracture is one of its key advantages. This new technique has been used to characterize the elastic modulus and fracture stress of two types of brittle films: polysilicon and silicon nitride. The Young’s modulus agrees with the literature data. The fracture stress of polysilicon is shown to increase with decreasing specimen surface size, in agreement with the recent literature. In addition, uniaxial tensile tests have been performed on 210 nm-thick Al films up to fracture. These results show that large ductility can be obtained in very thin freestanding films, which is important for many micro- and nano-systems developments.
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2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
A New on Chip Nanomechanical Testing Concept Applied to Brittle and Ductile Thin Films Materials
Thomas Pardoen,
Thomas Pardoen
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
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Asmahan Safi,
Asmahan Safi
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
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Michae¨l Coulombier,
Michae¨l Coulombier
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
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Pierre Carbonnelle,
Pierre Carbonnelle
Universite´ Catholique de Louvain; MEMS Instruments, Louvain-la-Neuve, Belgium
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Jean-Pierre Raskin,
Jean-Pierre Raskin
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
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Se´bastien Gravier
Se´bastien Gravier
Universite´ Joseph Fourier, St Martin d’He`res, France
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Thomas Pardoen
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
Asmahan Safi
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
Michae¨l Coulombier
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
Pierre Carbonnelle
Universite´ Catholique de Louvain; MEMS Instruments, Louvain-la-Neuve, Belgium
Jean-Pierre Raskin
Universite´ Catholique de Louvain, Louvain-la-Neuve, Belgium
Se´bastien Gravier
Universite´ Joseph Fourier, St Martin d’He`res, France
Paper No:
MicroNano2008-70232, pp. 261-269; 9 pages
Published Online:
June 12, 2009
Citation
Pardoen, T, Safi, A, Coulombier, M, Carbonnelle, P, Raskin, J, & Gravier, S. "A New on Chip Nanomechanical Testing Concept Applied to Brittle and Ductile Thin Films Materials." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 261-269. ASME. https://doi.org/10.1115/MicroNano2008-70232
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