The effect of embedded channels and cavities on the strength of LTCC substrates has been investigated by experiments, theoretical analysis and finite element analysis (FEA) simulation. The fracture behaviors characterized by flexural strength were measured by three-point bending tests and discussed according to the features of the microstructure, which was studied by Scanning Electron Microscope, Energy Spectrum Analysis and X-Ray Diffraction methods. The experimental results show that X and Y-axial channels have little effect on the flexural strength while Z-axial via-hole will greatly lower the strength due to the stress concentration. Two distinct components were observed: particles composed of synthetic corundum and matrix composed of corundum, silica, aluminum, and sodium calcium aluminum silicate. The FEA simulation gave similar results to the experiments and theoretical calculations and proved to be an effective method to predict possible condition of the fracture on substrates with complex internal structures.
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2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
Microstructure and Strength of Low Temperature Co-Fired Ceramic Substrates With Channels and Cavities
Yang-Fei Zhang,
Yang-Fei Zhang
Peking University, Beijing, China
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Min Miao,
Min Miao
Peking University; Beijing Information Technology Institute, Beijing, China
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Yu-Feng Jin,
Yu-Feng Jin
Peking University, Beijing, China
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Shu-Lin Bai
Shu-Lin Bai
Peking University, Beijing, China
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Yang-Fei Zhang
Peking University, Beijing, China
Min Miao
Peking University; Beijing Information Technology Institute, Beijing, China
Yu-Feng Jin
Peking University, Beijing, China
Shu-Lin Bai
Peking University, Beijing, China
Paper No:
MicroNano2008-70040, pp. 245-250; 6 pages
Published Online:
June 12, 2009
Citation
Zhang, Y, Miao, M, Jin, Y, & Bai, S. "Microstructure and Strength of Low Temperature Co-Fired Ceramic Substrates With Channels and Cavities." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 245-250. ASME. https://doi.org/10.1115/MicroNano2008-70040
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