Study of Package Technologies for Implantable Microdevices

This paper presents a study of packaging technologies for implantable microdevices. A RF microcoil is first designed and fabricated for implantable microdevices. Then, two methods using different materials and technologies for packaging have been developed. A RLC resonance circuit is adopted to test packaging performance. Measured results accord well with the predicted results from the circuit model and show that the method using multilayer Si_xN_y-SiO₂-Si_xN_y dielectric thin films and silicone have better packaging performance to let the implanted microdevice be able to work chronically.