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Proceedings Papers
In This Volume
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Front Matter
Heterogeneous Integration of Electronic Packages
Data Centers, Servers of the Future, Edge and Cloud Computing
Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Topics:
Cooling systems
,
Cooling
,
Heat
,
Heat flux
,
Computer cooling
,
Containment systems
,
Coolants
,
Copper
,
Density
,
Design
A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Topics:
Boilers
,
Carbon
,
Condensers (steam plant)
,
Cooling
,
Cooling systems
,
Emissions
,
Energy consumption
,
Film thickness
,
Fluids
,
Gases
BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Topics:
Dimensions
,
Errors
,
Failure
,
Failure analysis
,
Flow (Dynamics)
,
Manufacturing
,
Optical interconnections
,
Optics
,
Photonics
,
Resolution (Optics)
Flexible and Wearable Electronics
Power Electronics
Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Topics:
Bridges (Structures)
,
Cooling
,
Gallium nitride
,
Gates (Closures)
,
Optimization
Multiscale Heat Transfer in Optics and Energy Systems
Autonomous, Hybrid, and Electric Vehicles
Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading
Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Topics:
Damage
,
Failure
,
Modeling
,
Solder joints
,
Thermomechanics
,
Finite element analysis
,
Simulation
,
Stress
,
Deformation
,
Solders
Reliability of Electronic Packages and Systems
Module-Level TIM Degradation in HALT
Topics:
Aluminum
,
Cooling
,
Cycles
,
Electronics
,
Energy dissipation
,
Heating
,
Junctions
,
Life testing
,
Maintenance
,
Random vibration
CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate
Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi
Topics:
Computational fluid dynamics
,
Cooling
,
Flow (Dynamics)
,
Impellers
,
Density
,
Electronic equipment
,
Packaging
,
Fans
,
Flow visualization
,
Pressure
Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics
Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines
Topics:
Aerosols
,
Electronics
,
Finite element methods
,
Finite element model
,
Modeling
,
Printing
,
Silver
,
Temperature
Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Topics:
Lead-free solders
,
Mechanical properties
,
Solder joints
,
Solders
,
Tensile strength
,
Thermal shock
,
Yield strength
,
Stress
,
Cycles
,
High temperature
Nano-Scale Thermal Transport and Materials
Thermal Transport Across Al-(AlxGa1-x)2O3 and Al-Ga2O3 Interfaces
Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Topics:
Alloys
,
Aluminum
,
Cathode rays
,
Chemical reactions
,
Cooling
,
Electrical conductance
,
Electron beams
,
Electronics
,
Energy dissipation
,
Gallium