Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

August 27–30, 2018

San Francisco, California, USA

Conference Sponsors:

ISBN:

978-0-7918-5192-0

In This Volume

Heterogeneous Integration: Micro-Systems With Diverse Functionality (8)
Servers of the Future, IoT, and Edge to Cloud (12)
Structural and Physical Health Monitoring (7)
Power Electronics, Energy Conversion, and Storage (26)
Autonomous, Hybrid, and Electric Vehicles (9)

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Heterogeneous Integration: Micro-Systems With Diverse Functionality

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

InterPACK 2018; V001T01A001doi:https://doi.org/10.1115/IPACK2018-8211

Abstract

View Article

Topics: Light-emitting diodes , Packaging , Silicones , Wetting , Coating processes , Coatings , Phosphors , Domes (Structural elements) , Geometry , Particulate matter

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy

InterPACK 2018; V001T01A002doi:https://doi.org/10.1115/IPACK2018-8212

Abstract

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Topics: Nanoparticles , Thermal conductivity , Heat , Heat transfer , Heat conduction , Radiation (Physics) , Thermal management

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen

InterPACK 2018; V001T01A003doi:https://doi.org/10.1115/IPACK2018-8226

Abstract

View Article

Topics: Cements (Adhesives) , Ceramics , Low temperature , Manufacturing , Packaging , Ultraviolet radiation , Shear strength , Hardening (Curing) , Heat , Light-emitting diodes

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park

InterPACK 2018; V001T01A004doi:https://doi.org/10.1115/IPACK2018-8257

Abstract

View Article

Topics: Packaging , Corners (Structural elements) , Finite element analysis , Deformation , Delamination , Fracture (Materials) , Fracture (Process) , Reliability , Damage , Electronics

Lidded vs. Lidless: A Thermal Study

Xiaopeng Huang, Vadim Gektin

InterPACK 2018; V001T01A005doi:https://doi.org/10.1115/IPACK2018-8294

Abstract

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Topics: Design , Junctions , Packaging , Thermal resistance

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo

InterPACK 2018; V001T01A006doi:https://doi.org/10.1115/IPACK2018-8301

Abstract

View Article

Topics: Temperature , Phosphors , Silicones , Light sources , Light-emitting diodes , Nanoparticles , Quantum dots , Rendering , Shells , Stability

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri

InterPACK 2018; V001T01A007doi:https://doi.org/10.1115/IPACK2018-8337

Abstract

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Topics: Algorithms , Fillers (Materials) , Packing (Shipments) , Packings (Cushioning) , Design , Elastic moduli , Heat , Thermal conductivity , Viscosity , Errors

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha

InterPACK 2018; V001T01A008doi:https://doi.org/10.1115/IPACK2018-8345

Abstract

View Article

Topics: Adhesives , Creep , Pressure , Stress , Bonding , Hydrostatics , Temperature , Cavitation , Cavities , Design

Servers of the Future, IoT, and Edge to Cloud

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer

InterPACK 2018; V001T02A001doi:https://doi.org/10.1115/IPACK2018-8253

Abstract

View Article

Topics: Artificial neural networks , Data centers , Cooling , Evaporative cooling , Cooling systems , Neural network models , Temperature , Algorithms , Computation , Control systems

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic

InterPACK 2018; V001T02A002doi:https://doi.org/10.1115/IPACK2018-8254

Abstract

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Topics: Integrated circuit packaging , Metal bonding , Polymers , Bonding , Manufacturing , Metals , Adhesion , Warping , Adhesives , Chemistry

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

Manasa Sahini, Chinmay Kshirsagar, Patrick McGinn, Dereje Agonafer

InterPACK 2018; V001T02A003doi:https://doi.org/10.1115/IPACK2018-8255

Abstract

View Article

Topics: Coolants , Cooling , Water , Data centers , Pumps , Stress , Temperature , Energy consumption , Heat exchangers , Exhaust systems

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang

InterPACK 2018; V001T02A004doi:https://doi.org/10.1115/IPACK2018-8300

Abstract

View Article

Topics: Internet of things , Stress , Vehicles , Circuits , Computer software , Cooling , Cycles , Energy dissipation , Flip-chip packages , Modeling

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi

InterPACK 2018; V001T02A005doi:https://doi.org/10.1115/IPACK2018-8305

Abstract

View Article

Topics: Cooling , Data centers , Energy efficiency , Temperature , Stress , Energy consumption , Internet of things , Air conditioning , Air flow , Cloud computing

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati

InterPACK 2018; V001T02A006doi:https://doi.org/10.1115/IPACK2018-8334

Abstract

View Article

Topics: Cooling , Data centers , Experimental analysis , Failure , Instrumentation , Cooling systems , Temperature , Containment , Equipment performance , Pressure

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman

InterPACK 2018; V001T02A007doi:https://doi.org/10.1115/IPACK2018-8338

Abstract

View Article

Topics: Cycles , Fatigue , Solders , Temperature , Solder joints , Ball-Grid-Array packages , Ball-Grid-Array packaging , Coatings , Dimensions , Electronic products

A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers

Mullaivendhan Varadharasan, Dereje Agonafer, Ahmed Al Khazraji, Jimil Shah, Ashwin Siddarth, James Hoverson, Mike Kaler

InterPACK 2018; V001T02A008doi:https://doi.org/10.1115/IPACK2018-8378

Abstract

View Article

Topics: Cooling , Data centers , Thermomechanics , Flow (Dynamics) , Incrustations , Temperature , Wetting , Air flow , Evaporative cooling , Water

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

InterPACK 2018; V001T02A009doi:https://doi.org/10.1115/IPACK2018-8422

Abstract

View Article

Topics: Containment systems , Design , Air flow , Containment , Cooling , Fans , Leakage , Sensors , Control equipment , Data centers

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty

InterPACK 2018; V001T02A010doi:https://doi.org/10.1115/IPACK2018-8432

Abstract

View Article

Topics: Temperature , Pumps , Cooling , Fluids , Failure , Operating temperature , Air pollution , Condensation , Corrosion , Data centers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer

InterPACK 2018; V001T02A011doi:https://doi.org/10.1115/IPACK2018-8436

Abstract

View Article

Topics: Air flow , Data centers , Density , Flow simulation , Particulate matter , Cooling , Contamination , Air conditioning , Carbon , Computer software

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

InterPACK 2018; V001T02A012doi:https://doi.org/10.1115/IPACK2018-8443

Abstract

View Article

Topics: Cooling , Cooling systems , Data centers , Failure analysis , Failure , Temperature , Coolants , Heat

Structural and Physical Health Monitoring

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin

InterPACK 2018; V001T03A001doi:https://doi.org/10.1115/IPACK2018-8219

Abstract

View Article

Topics: Calibration , Design , Sensors , Silicon , Stress , Resistors , Temperature , Aerospace systems , Drilling , Geothermal power stations

Thermal Characterization of Si BEOL Microelectronic Structures

Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande

InterPACK 2018; V001T03A002doi:https://doi.org/10.1115/IPACK2018-8350

Abstract

View Article

Topics: Computer simulation , Design , Dimensions , Heat sinks , Operating temperature , Reliability , Resistors , Temperature , Thermal characterization , Thermal properties

Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling

Chienchih Chen, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2018; V001T03A003doi:https://doi.org/10.1115/IPACK2018-8398

Abstract

View Article

Topics: Finite element analysis , Solder joints , Simulation , Electronic packaging , Stress , Algorithms , Alloys , Ball-Grid-Array packaging , Computers , Density

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2018; V001T03A004doi:https://doi.org/10.1115/IPACK2018-8405

Abstract

View Article

Topics: Hardening (Curing) , Mechanical behavior , Solder masks , Temperature , Ultraviolet radiation , Creep , Mechanical properties , Elastic moduli , Stress , Tensile testing

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2018; V001T03A005doi:https://doi.org/10.1115/IPACK2018-8408

Abstract

View Article

Topics: Lead-free solders , Mechanical properties , Nanoindentation , Tin , Solder joints , Particulate matter , Composite materials , Creep , Deformation , Elastic moduli

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2018; V001T03A006doi:https://doi.org/10.1115/IPACK2018-8410

Abstract

View Article

Topics: Lead-free solders , Poisson ratio , Temperature effects , Solders , Temperature , Cooling , Finite element analysis , Finite element methods , Finite element model , Reliability

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

InterPACK 2018; V001T03A007doi:https://doi.org/10.1115/IPACK2018-8414

Abstract

View Article

Topics: Solders , Fracture (Materials) , Solder joints , Temperature , Damage , Electronic packages , Fatigue failure , Glass , Intermetallic compounds , Lead-free solders

Power Electronics, Energy Conversion, and Storage

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo

InterPACK 2018; V001T04A001doi:https://doi.org/10.1115/IPACK2018-8210

Abstract

View Article

Topics: Flow (Dynamics) , Micropumps , Fluid dynamics , Pressure , Journal bearings , Pumps , Rotors , Bearings , Cooling , Cooling systems

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo

InterPACK 2018; V001T04A002doi:https://doi.org/10.1115/IPACK2018-8225

Abstract

View Article

Topics: Glass , Light-emitting diodes , Phosphors , Emissions , Ions , Low temperature , Melting , Printing , Rendering , Sintering

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet

InterPACK 2018; V001T04A003doi:https://doi.org/10.1115/IPACK2018-8256

Abstract

View Article

Topics: Cooling , Design , Electrons , Gallium nitride , Heat , Manufacturing , Mechanical admittance , Optimization , Packaging , Raman spectroscopy

A Review of Degradation Behavior and Modeling of Capacitors

Anunay Gupta, Om Prakash Yadav, Douglas DeVoto, Joshua Major

InterPACK 2018; V001T04A004doi:https://doi.org/10.1115/IPACK2018-8262

Abstract

View Article

Topics: Capacitors , Modeling , Failure , Electronic systems , Metallized plastic film , Physics , Reliability

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink

InterPACK 2018; V001T04A005doi:https://doi.org/10.1115/IPACK2018-8275

Abstract

View Article

Topics: Fatigue failure , Reliability , Stress , Damage , Design , Fatigue , Finite element analysis , Solders , Failure , Flip-chip

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu

InterPACK 2018; V001T04A006doi:https://doi.org/10.1115/IPACK2018-8276

Abstract

View Article

Topics: Silver , Particulate matter , Pressure , Collaboration , Displacement , Electronics , Energy gap , High pressure (Physics) , High temperature , Manufacturing

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler

InterPACK 2018; V001T04A007doi:https://doi.org/10.1115/IPACK2018-8279

Abstract

View Article

Topics: Ceramics , Electronic packaging , Sprays , Copper , Manufacturing , Reliability , Aluminum , Bonding , Brittleness , Computer simulation

Long-Term Effects of Power Quality and Power Cycling on Thermoelectric Module Performance

Viral K. Patel, Hsin Wang, Kyle R. Gluesenkamp, Anthony Gehl, Geoffrey Ormston, Emily Kirkman

InterPACK 2018; V001T04A008doi:https://doi.org/10.1115/IPACK2018-8282

Abstract

View Article

Topics: Energy consumption , Heat , Heating and cooling , Temperature

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu

InterPACK 2018; V001T04A009doi:https://doi.org/10.1115/IPACK2018-8307

Abstract

View Article

Topics: Architecture , Corners (Structural elements) , Design , Electronic packages , Electronics , Energy gap , Failure , Finite element methods , High temperature , Nanostructures

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer

InterPACK 2018; V001T04A010doi:https://doi.org/10.1115/IPACK2018-8311

Abstract

View Article

Topics: Evaporation , Shapes , Drops , Vapors , Cooling , Computer cooling , Computer simulation , Design , Diffusion (Physics) , Electric fields

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Libin Zhang, Guo Zhu, Kuan Sun, Zhiyin Gan, Xiaobing Luo

InterPACK 2018; V001T04A011doi:https://doi.org/10.1115/IPACK2018-8315

Abstract

View Article

Topics: Atoms , Crystals , Molecular dynamics simulation , Surface roughness , Temperature

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi

InterPACK 2018; V001T04A012doi:https://doi.org/10.1115/IPACK2018-8322

Abstract

View Article

Topics: Computer cooling , Electrohydrodynamics , Heat conduction , Pumps , Flow (Dynamics) , Flexible electronics , Microscale devices , Actuators , Biology , Biomedicine

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

Michael Ozeh, A. G. Agwu Nnanna

InterPACK 2018; V001T04A013doi:https://doi.org/10.1115/IPACK2018-8354

Abstract

View Article

Topics: Generators , Heat recovery , Heat sinks , Heat pipes , Nanoparticles , Electronics , Heat , Heat exchangers , Metals , Temperature gradient

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero

InterPACK 2018; V001T04A014doi:https://doi.org/10.1115/IPACK2018-8355

Abstract

View Article

Topics: Design , Electronic systems , Flux (Metallurgy) , Heat , Heat flux , High temperature , Instrumentation , Junctions , Military systems , Power systems (Machinery)

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen

InterPACK 2018; V001T04A015doi:https://doi.org/10.1115/IPACK2018-8383

Abstract

View Article

Topics: Flow (Dynamics) , Gravity (Force) , Coolers , Boiling , Cooling , Flux (Metallurgy) , Heat , Aircraft , Fluids , Gravitational acceleration

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha

InterPACK 2018; V001T04A016doi:https://doi.org/10.1115/IPACK2018-8385

Abstract

View Article

Topics: Failure mechanisms , Electronics , Reliability , Acoustics , Automotive industry , Cooling , Elastic moduli , Failure analysis , Heating , High temperature

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, A. G. Agwu Nnanna

InterPACK 2018; V001T04A017doi:https://doi.org/10.1115/IPACK2018-8387

Abstract

View Article

Topics: Activated carbon , Steam , Sunlight , Carbon nanotubes , Nanoparticles , Water , Solar energy , Evaporation , Light , Medical devices

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey

InterPACK 2018; V001T04A018doi:https://doi.org/10.1115/IPACK2018-8392

Abstract

View Article

Topics: Tension-leg platforms , Tin , Transients (Dynamics) , Alloys , High temperature , Nanoindentation , Shear (Mechanics) , Stress , Copper , Electronic systems

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

L. M. Boteler, S. M. Miner

InterPACK 2018; V001T04A019doi:https://doi.org/10.1115/IPACK2018-8394

Abstract

View Article

Topics: Finite element analysis , Stress analysis (Engineering) , Design , Temperature , Stress , Modeling , Thermal stresses , Computation , Convection , Flat heat pipes

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Mohammad S. Alam, K. M. Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2018; V001T04A020doi:https://doi.org/10.1115/IPACK2018-8396

Abstract

View Article

Topics: Lead-free solders , Mechanical behavior , Temperature effects , High temperature , Solders , Temperature , Mechanical properties , Alloys , Stress , Tensile strength

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng

InterPACK 2018; V001T04A021doi:https://doi.org/10.1115/IPACK2018-8447

Abstract

View Article

Topics: Boiling , Flow (Dynamics) , Heat transfer , Microchannels , Visualization , Nucleate boiling , Bubbles , Fluids , Flux (Metallurgy) , Heat

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou

InterPACK 2018; V001T04A022doi:https://doi.org/10.1115/IPACK2018-8448

Abstract

View Article

Topics: Heat exchangers , Optimization , Artificial neural networks , Flow (Dynamics) , Reynolds number , Friction , Pressure drop , Computational fluid dynamics , Computer simulation , Design

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang

InterPACK 2018; V001T04A023doi:https://doi.org/10.1115/IPACK2018-8449

Abstract

View Article

Topics: Condensation , Evaporation , Heat transfer , Heat transfer coefficients , Refrigerants , Pressure drop , Temperature , Vapors , Climate change , Flux (Metallurgy)

Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

Wei Li, Chuancai Zhang, Zhichuan Sun, Zhichun Liu, Lianxiang Ma, Yan He, Bin Zhang, Wei Chen, David J. Kukulka

InterPACK 2018; V001T04A024doi:https://doi.org/10.1115/IPACK2018-8454

Abstract

View Article

Topics: Evaporation , Flow (Dynamics) , Heat transfer , Heat transfer coefficients , Temperature , Turbulence , Vapors

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won

InterPACK 2018; V001T04A025doi:https://doi.org/10.1115/IPACK2018-8456

Abstract

View Article

Topics: Cooling , Copper , Design , Electronics , Energy dissipation , Evaporation , Evaporative cooling , Heat , Heat conduction , Heat flux

Practical Concerns for Adoption of Microjet Cooling

Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin

InterPACK 2018; V001T04A026doi:https://doi.org/10.1115/IPACK2018-8468

Abstract

View Article

Topics: Cooling , Electronics , Erosion , Flux (Metallurgy) , Heat , Numerical analysis , Operating temperature , Power density , Pressure , Robustness

Autonomous, Hybrid, and Electric Vehicles

In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration

Guo Xiaochuan

InterPACK 2018; V001T05A001doi:https://doi.org/10.1115/IPACK2018-8214

Abstract

View Article

Topics: Airbags , Printed circuit boards , Stress , Vibration , Design , Simulation , Simulation models , Finite element analysis , Manufacturing , Plate theory

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

Bakhtiyar Mohammad Nafis, Ange Iradukunda, David Huitink

InterPACK 2018; V001T05A002doi:https://doi.org/10.1115/IPACK2018-8280

Abstract

View Article

Topics: Design , Electric vehicles , Reliability , Traction , Temperature , Cooling , Roads , Temperature profiles , Batteries , Electric motors

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Alexander Otto, Sven Rzepka, Bernhard Wunderle

InterPACK 2018; V001T05A003doi:https://doi.org/10.1115/IPACK2018-8348

Abstract

View Article

Topics: Automotive industry , Cycles , Electronics , Stress , Reliability , Heating , Testing , Failure , Failure mechanisms , Junctions

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas

InterPACK 2018; V001T05A004doi:https://doi.org/10.1115/IPACK2018-8356

Abstract

View Article

Topics: Damage assessment , Electronics , Temperature , Vibration , Damage , Failure , Signals , Safety , High temperature , Principal component analysis

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

InterPACK 2018; V001T05A005doi:https://doi.org/10.1115/IPACK2018-8357

Abstract

View Article

Topics: Constitutive equations , High temperature , Lead-free solders , Mechanical properties , Storage , Solders , Alloys , Drilling , Electronics , Geometry

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen

InterPACK 2018; V001T05A006doi:https://doi.org/10.1115/IPACK2018-8358

Abstract

View Article

Topics: Copper , Reliability , Silver , Wire , Failure mechanisms , Shear strength , High temperature , Shear (Mechanics) , Wire bonding , Aluminum

Thermal Model Based Fault Detection and Isolation of Power Inverter IGBT Module

Madi Zholbaryssov, Azeem Sarwar

InterPACK 2018; V001T05A007doi:https://doi.org/10.1115/IPACK2018-8368

Abstract

View Article

Topics: Flaw detection , Vehicles , Fuels , Wheels , Alternating current (Electricity) , Batteries , Electric motors , Electric propulsion , Electric vehicles , Emissions

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

M. Niessner, G. Haubner, W. Hartner, S. Pahlke

InterPACK 2018; V001T05A008doi:https://doi.org/10.1115/IPACK2018-8379

Abstract

View Article

Topics: Design , Radar , Reliability , Solder joints , Simulation , Laminates , Accelerated life testing , Ball-Grid-Array packaging , Materials properties , Mechanical properties

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

InterPACK 2018; V001T05A009doi:https://doi.org/10.1115/IPACK2018-8386

Abstract

View Article

Topics: Condition monitoring , Electronic systems , Sensors , Vibration , Failure , Delamination , Electronics , Manufacturing , Physics , Reflow soldering

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Proceedings Papers

Heterogeneous Integration: Micro-Systems With Diverse Functionality

Servers of the Future, IoT, and Edge to Cloud

Structural and Physical Health Monitoring

Power Electronics, Energy Conversion, and Storage

Autonomous, Hybrid, and Electric Vehicles

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