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Proceedings Papers

Proceedings Volume Cover
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
October 25–27, 2022
Garden Grove, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-8655-7
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Front Matter

InterPACK 2022; V001T00A001https://doi.org/10.1115/IPACK2022-FM1

Data Centers, Servers of the Future, Edge and Cloud Computing

InterPACK 2022; V001T01A001https://doi.org/10.1115/IPACK2022-92005
InterPACK 2022; V001T01A002https://doi.org/10.1115/IPACK2022-96972
Topics: Cooling
InterPACK 2022; V001T01A003https://doi.org/10.1115/IPACK2022-97047
InterPACK 2022; V001T01A004https://doi.org/10.1115/IPACK2022-97364
InterPACK 2022; V001T01A005https://doi.org/10.1115/IPACK2022-97386
InterPACK 2022; V001T01A006https://doi.org/10.1115/IPACK2022-97402
InterPACK 2022; V001T01A007https://doi.org/10.1115/IPACK2022-97416
InterPACK 2022; V001T01A008https://doi.org/10.1115/IPACK2022-97421
InterPACK 2022; V001T01A009https://doi.org/10.1115/IPACK2022-97425
InterPACK 2022; V001T01A010https://doi.org/10.1115/IPACK2022-97429
InterPACK 2022; V001T01A011https://doi.org/10.1115/IPACK2022-97434
InterPACK 2022; V001T01A012https://doi.org/10.1115/IPACK2022-97443
InterPACK 2022; V001T01A013https://doi.org/10.1115/IPACK2022-97445
InterPACK 2022; V001T01A014https://doi.org/10.1115/IPACK2022-97447
InterPACK 2022; V001T01A015https://doi.org/10.1115/IPACK2022-97478
InterPACK 2022; V001T01A016https://doi.org/10.1115/IPACK2022-97481
InterPACK 2022; V001T01A017https://doi.org/10.1115/IPACK2022-97490
InterPACK 2022; V001T01A018https://doi.org/10.1115/IPACK2022-97494
InterPACK 2022; V001T01A019https://doi.org/10.1115/IPACK2022-97587
InterPACK 2022; V001T01A020https://doi.org/10.1115/IPACK2022-97729
InterPACK 2022; V001T01A021https://doi.org/10.1115/IPACK2022-96370

Digital Technologies in Microelectronics

InterPACK 2022; V001T02A001https://doi.org/10.1115/IPACK2022-97186

Flexible and Wearable Electronics

InterPACK 2022; V001T03A001https://doi.org/10.1115/IPACK2022-94052
InterPACK 2022; V001T03A002https://doi.org/10.1115/IPACK2022-97363
InterPACK 2022; V001T03A003https://doi.org/10.1115/IPACK2022-97382
InterPACK 2022; V001T03A004https://doi.org/10.1115/IPACK2022-97428
InterPACK 2022; V001T03A005https://doi.org/10.1115/IPACK2022-97430
InterPACK 2022; V001T03A006https://doi.org/10.1115/IPACK2022-97431
InterPACK 2022; V001T03A007https://doi.org/10.1115/IPACK2022-97432
InterPACK 2022; V001T03A008https://doi.org/10.1115/IPACK2022-97437
InterPACK 2022; V001T03A009https://doi.org/10.1115/IPACK2022-97450
InterPACK 2022; V001T03A010https://doi.org/10.1115/IPACK2022-97451
InterPACK 2022; V001T03A011https://doi.org/10.1115/IPACK2022-97456
InterPACK 2022; V001T03A012https://doi.org/10.1115/IPACK2022-97457

Harsh Environment Electronic Applications for Transportation Systems

InterPACK 2022; V001T04A001https://doi.org/10.1115/IPACK2022-96542
InterPACK 2022; V001T04A002https://doi.org/10.1115/IPACK2022-97424
InterPACK 2022; V001T04A003https://doi.org/10.1115/IPACK2022-97452

Heterogeneous Integration

InterPACK 2022; V001T05A001https://doi.org/10.1115/IPACK2022-96751
InterPACK 2022; V001T05A002https://doi.org/10.1115/IPACK2022-97218
InterPACK 2022; V001T05A003https://doi.org/10.1115/IPACK2022-97338
InterPACK 2022; V001T05A004https://doi.org/10.1115/IPACK2022-97719

Multi-Scale Thermal Transport, Thermal Materials, and Energy Systems

InterPACK 2022; V001T07A001https://doi.org/10.1115/IPACK2022-97204
InterPACK 2022; V001T07A002https://doi.org/10.1115/IPACK2022-97399
InterPACK 2022; V001T07A003https://doi.org/10.1115/IPACK2022-97476

Photonics and Optics

InterPACK 2022; V001T08A001https://doi.org/10.1115/IPACK2022-97220
InterPACK 2022; V001T08A002https://doi.org/10.1115/IPACK2022-97266
InterPACK 2022; V001T08A003https://doi.org/10.1115/IPACK2022-97400
InterPACK 2022; V001T08A004https://doi.org/10.1115/IPACK2022-97455

Power Electronics

InterPACK 2022; V001T09A001https://doi.org/10.1115/IPACK2022-96635
InterPACK 2022; V001T09A002https://doi.org/10.1115/IPACK2022-97172
InterPACK 2022; V001T09A003https://doi.org/10.1115/IPACK2022-97283
InterPACK 2022; V001T09A004https://doi.org/10.1115/IPACK2022-97355
InterPACK 2022; V001T09A005https://doi.org/10.1115/IPACK2022-97412
InterPACK 2022; V001T09A006https://doi.org/10.1115/IPACK2022-97446
InterPACK 2022; V001T09A007https://doi.org/10.1115/IPACK2022-97669
InterPACK 2022; V001T09A008https://doi.org/10.1115/IPACK2022-97886
InterPACK 2022; V001T09A009https://doi.org/10.1115/IPACK2022-98066
InterPACK 2022; V001T09A010https://doi.org/10.1115/IPACK2022-98077
InterPACK 2022; V001T09A011https://doi.org/10.1115/IPACK2022-98800

Reliability of Electronic Packages and Systems

InterPACK 2022; V001T10A001https://doi.org/10.1115/IPACK2022-92306
InterPACK 2022; V001T10A002https://doi.org/10.1115/IPACK2022-93878
InterPACK 2022; V001T10A003https://doi.org/10.1115/IPACK2022-94505
InterPACK 2022; V001T10A004https://doi.org/10.1115/IPACK2022-97175
InterPACK 2022; V001T10A005https://doi.org/10.1115/IPACK2022-97253
InterPACK 2022; V001T10A006https://doi.org/10.1115/IPACK2022-97349
InterPACK 2022; V001T10A007https://doi.org/10.1115/IPACK2022-97423
InterPACK 2022; V001T10A008https://doi.org/10.1115/IPACK2022-97427
InterPACK 2022; V001T10A009https://doi.org/10.1115/IPACK2022-97433
InterPACK 2022; V001T10A010https://doi.org/10.1115/IPACK2022-97438
InterPACK 2022; V001T10A011https://doi.org/10.1115/IPACK2022-97440
InterPACK 2022; V001T10A012https://doi.org/10.1115/IPACK2022-97448
InterPACK 2022; V001T10A013https://doi.org/10.1115/IPACK2022-97449
InterPACK 2022; V001T10A014https://doi.org/10.1115/IPACK2022-97453
InterPACK 2022; V001T10A015https://doi.org/10.1115/IPACK2022-97614
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