... between processor chip and low power double data rate (LPDDR) memory. While the extent of CTE mismatch increased in this architecture, posing significant warpage driven yield loss, researchers have successfully developed finite elements-based simulation methods to predict warpage accurately. Some...

.... These devices and their printed circuit boards (PCBs) are designed to be thin and lighter for many applications and the severe warpage is one of the serious reliability concerns. The warpage has caused reliability issues such as soldering defects, bridging, stretching, head-in pillow, and non-wet opens...

... space of 1/1um and introduce the related process challenge, microstructure data. FO-MCM RDL warpage FAN-OUT MCM SOLUTIONS STUDY FOR HETEROGENEOUS INTEGRATION ON INTELLIGENT COMPUTING APPLICATION Chu-Pao(Otis) Hung*, Yu-Po Wang, Steven Chen, and Katch Wan Siliconware Precision Industries Co...

... Abstract Low-Density Fan-Out (LDFO) (or fan-out wafer-level packaging) technologies are getting significant attention for heterogeneous system integration in many applications. Despite many studies, excessive wafer warpage is still a challenge for many process steps in these technologies...

... as disadvantages. FC m BGA uses molding compound or EMC instead of capillary underfill, to protect FC die, and eliminate the need for a lid. Package warpage reduced a lot by adding a lid with the bare die FC package. However, the package and board level reliability for the above package types are still debatable...

.... To guarantee the assembly yield and reliability of the solder joint between the top package and bottom package, mechanical compliance between these two packages is crucial during package stacking. Henceforth package warpage needs to be understood and controlled to meet the assembly yield targets...

... 12 01 2010 Underfill is one of the crucial materials in flip chip (FC) packages. The role of underfill is not only to protect the solder bumps but to minimize package warpage, and to protect the fragile low k dielectric at end of line (EOL), moisture resistance test (MRT...

... consisting of organic/composites (e.g. FR4) and circuit layers, laminated together. Such multi-layered structures exhibit ‘board warpage’ during manufacturing process. It is a result of residual thermo-mechanical stresses along with any asymmetries (if present) during the curing process. This effect further...

... warpage layup layout printed wiring board (PWB) printed wiring board assembly (PWBA) thermal CTE PWBA warpage is further compounded by the high densification of the PWBA, where heat dissipation occurs over a very small area during in-service operation. Automated component placement...