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Keywords: transient state
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Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6390
..., this research aims to establish transient state compact thermal model for microprocessor package. This paper briefly introduces steady state compact thermal model for microprocessor, which is proposed as previous work, then, points out key point to extend the model to transient state model. Transient thermal...
Topics:
Transients (Dynamics)
