1-6 of 6
Keywords: transient
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97425
... methods to dissipate the high heat fluxes of modern high-power CPUs and GPUs. While the published literature has well-documented research on the thermal aspects of direct liquid cooling, a detailed account of transient hydraulic investigation is still missing. In this experiment, a total of four 52U racks...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2606
... resistance of the package which can have a detrimental effect on transient thermal performance if thermal capacitance is reduced. In order to provide both a low thermal resistance and a higher thermal capacitance integrated into the package and near the thermal junction, a new cold plate called the Package...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A038, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73186
... Transient Hotspot Thermoelectric Cooling Self Cooling On-chip kW-level hotspots have become a significant factor in the thermal design of modern electronic packages. Thermoelectric cooling has been shown to be capable of suppressing such hotspots, but it is not yet clear how to best...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89110
... 07 01 2011 System-level thermal transient analysis of High-Power Dynamic Microelectronics System is performed using numerical simulations. The SmartMOS-type device is packaged in 20 lead SOIC module with exposed copper slug. The package is attached to 4-layer PCB with embedded thermal...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33705
... 12 01 2010 A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The SmartMOS-type device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug. The package is attached...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35167
...) and a power package (SILP). Finally, a method is presented to calibrate detailed models using experimental response curves, thereby eliminating the need for the sometimes unreliable and time- consuming steady state measurements. Keywords: compact thermal models, dynamic, time- dependent, transient, thermal...