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Proceedings Papers

Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages

Koji Nishi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6390
https://doi.org/10.1115/IPACK2019-6390
... spreading resistance is emulated and the effect is checked by comparing with three-dimensional simulation. compact thermal model microprocessor thermal spreading resistance transient state INVESTIGATION REGARDING TRANSIENT COMPACT THERMAL MODEL FOR MICROPROCESSOR PACKAGES Koji Nishi1 Ashikaga...
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Topics: Transients (Dynamics)