... efficiency to address the increasing power densities of Information Technology (IT) equipment and the consequent rise in energy consumption. Consequently, there is a significant pivot towards efficient cooling mechanisms that emphasize thermal management and energy efficiency. Against this backdrop, our...

... Abstract Thermal modelling is a very important aspect of the thermal management of semiconductor chips. Developing a reliable 3D thermal model is critical. The 3D model will provide a 3-dimensional representation of the thermal behavior within the chip. 3-dimensional heat generation...

... Abstract Boiling is an essential heat and mass transfer process that is employed in numerous applications ranging from power generation and seawater desalination to thermal management of electronic components. Nucleate boiling, where vapor bubbles nucleate, grow, and depart from active...

... apparatus with circuitry completely immersed in liquid while operating is discussed. In addition, short- and long-term tests were performed. Details of the tests and the results are discussed in this article. thermal management electronics cooling heat transfer coolants circulating immersion...

... Abstract The performance of a capillary-driven two-phase cold plate (CP) for thermal management of high heat flux electronic devices was investigated. The CP was a key component of a hybrid two-phase cooling system (HTPCS). The HTPCS operated with the refrigerant R245fa and integrated...

... as they host digital infrastructure. However, data centers can consume significant amounts of energy, and a substantial amount of this energy goes to cooling systems. Efficient thermal management of information technology equipment is therefore essential and allows the user to obtain peak performance from...

... Abstract A numerical analysis of the effects of water-cooled cold plate designs and the coolant inlet velocity on the thermal management of computer chips with hotspots is presented. With the increasing demand for computational capabilities of highperformance computing, non-uniform temperature...

... sink optimization beyond server-dependent solutions. The proposed approach can also be extended to other cooling techniques and applications, where optimizing the design variables of heat sinks can improve cooling performance and reduce energy consumption. data center thermal management...

... coefficients. The CIO surface samples in water were oxidized, most likely due to the presence of air in water and in the experimental vessel. power electronics data centers thermal management two-phase heat transfer surface enhancement copper inverse opal critical heat flux extreme heat flux...

... Abstract The thermal management of automotive electronic devices has become a critical technology as the power consumption and resulting heat dissipation of these devices have increased significantly. Electronic control units (ECUs) are a critical component of automotive power electronics...

... (MV) electronics are an essential component in grid-tied applications. However, thermal management of such components presents a barrier to pushing the boundaries of high-power density, while maintaining high efficiency and reliability. Thermal management is further complicated by the need to maintain...

.... A forced convection based thermal management solution is presented for the Rotor Drive Electronics (RDE) unit, a high power electronics box responsible for controlling the rotors that allow the Lander to fly on Titan. A thermal flow model is built in Solidworks Flow Simulation to evaluate the effectiveness...

... design point with the help of a Response Surface 2D and 3D plot for the individual heat sink assembly. single-phase immersion cooling optimization thermal management heat transfer coefficient heatsink dielectric fluid Proceedings of the ASME 2023 International Technical Conference...

... fabricated from SiC is capable of meeting heat dissipation targets of 100 W/cm 2 while maintaining thermal resistance below 2 K/W and ΔP within 1 kPa utilizing single-phase working fluid. embedded cooling microfluidic system thermal management Proceedings of the ASME 2023 International Technical...

... Abstract Boiling is an important heat and mass transfer process that has tremendous benefits in thermal management applications where timely and efficient heat removal is critical for operation. Boiling is inherently limited by the critical heat flux (CHF), which is the maximum heat flux...

.... This innovative process involves producing an ultra-smooth (20 nm RMS) sacrificial Au/Cu foil that is used to electroplate CuNWs, PDMS infiltration, and finally, Cu and Sn film overplating to form the final TIM “tape”. thermal interface materials thermal management copper nanowires solder bonding...

...-phase cooling efficiency thermal management refrigeration Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022, Garden Grove, California IPACK2022-97047 DIRECT-TO-CHIP...

... Abstract Traditional air-cooling along with corresponding heat sinks are beginning to reach performance limits, requiring lower air-supply temperatures and higher air-supply flowrates, in order to meet the rising thermal management requirements of high power-density electronics. A switch from...

... orientation’s average wall temperature by about 2%. Our future work will look to gather experimental data for the specified heat sinks and boundary conditions. thermal management natural convection battery chargers heat sinks segmented fins inclined fins pin fins Proceedings of the ASME 2022...

...) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance. jet impingement power electronics thermal management wide bandgap Proceedings of the ASME 2022 International Technical Conference and Exhibition...