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Keywords: thermal cycle (TC)
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Paper No: IPACK2019-6563
... solder, Modulus, Ultimate Tensile Strength, Stress- Strain Curve, Aging, Thermal Cycle (TC), and Thermal Shock (TS) INTRODUCTION With the growth of electronic packaging industries, ranging from automobile to hand-held products, reliability is the major concern. Also, to keep pace with the increasing...