... devices multi-die stacked systems thermal conduction Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC) Leila Choobineh Mechanical and Aerospace Engineering University of Texas, Arlington Trent Uehling Freescale Semiconductor Austin, TX Nick Vo Freescale...

... are negligible when the bridge width and thickness change. Thermal noise analysis shows silicon carbide has the most physically meaningful displacements in comparison with silicon and cvd diamond. Convection nano-mechanical devices thermal conduction 1 Copyright © 2011 by ASME SIMULATION OF THERMAL...