... have employed the OrCAD software to build and simulate a digital circuit. The performance of the inverting circuit was compared and evaluated against the tolerance limits of the COTs. direct-write technique additive printing in-mold electronics flexible electronics PC silver ink...

... manufacturing process performance interaction silver ink water-based ink aerosol jet printer resistivity shear load to failure Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26...

... the intermetallics at the interface of conductive adhesive and additively printed circuits. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge gauge factor shear load to failure Proceedings of the ASME 2022 International...

... parameters for microvias for multilayer z-axis interconnections. direct-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive low-temperature solder multilayer process development sintering analysis shear load to failure...

... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...

...-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive process development sintering analysis shear load to failure LC filter Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging...