... of interconnect alloy and surface modifications to qualify/disqualify them for use in high current density and temperature environments. aluminum wire bonds nickel plating fuse current electromigration reliability Proceedings of the ASME 2024 International Technical Conference and Exhibition...

... layers. The electronics industry has evolved from 1-level to multi-stacked microvias for interconnections across multiple sequential layers. Automotive manufacturers. Aiming to reduce failure rates and processing costs, demand that microvias achieve a reliability standard of zero failures. To fulfill...

... Abstract As additive in-mold technologies gain traction in the automotive sector, there is a growing need for long-term reliability data under harsh conditions and acceleration factors to predict the technology’s lifespan. This paper aims to investigate how the performance and reliability...

... sustainable electronics, offering advantages in terms of materials efficiency, design flexibility, and environmental friendliness. However, ensuring the reliability of these printed electronics under HTOL (High Temperature Operating Life) conditions remains a critical challenge. The HTOL test involves...

... circuit demonstrator. in-mold electronics IME printed electronics gravure offset printing thermoforming PETG PC reliability additive printing Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...

... from different vendors. The selection of coolants in this study is based on their performance, compatibility with wetted materials, reliability during extended operation, and environmental impact, following the guidelines set by ASHRAE. To conduct the experiments, a single cold plate-based benchtop...

... connections for high junction temperatures. However, sintered silver bond-lines are porous, typically containing 15% to 20% volume fraction. This study aims to investigate the effects of these pores on the mechanical reliability of the bond-line. The simulations were conducted using ANSYS software...

... of the chips on the Chiplet module caused any reliability concern. A risk factor was calculated to determine if the power magnitude of the die is within the safe region. With risk factors, we will be able to quantify the differences of applied powers with respect to the maximum allowed limits. We have expanded...

... on test vehicle simulations: electrical-diffusion, electrical-thermal-diffusion and structural-thermal-electric-diffusion. The results of EM behavior as well as the computational time are compared. electromigration finite element analysis multiphysics atomic flux divergence reliability...

... Abstract One of the most important elements for market acceptance of new technologies is ensuring reliability. Nowhere is this truer than in the shift from well characterized fossil fuel technologies to newer renewable and sustainable energy technologies. The key enabling technology driving...

... applications in FHE devices. flexible encapsulants interfacial strength liquid encapsulation reliability flexible hybrid electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021...

... of Ag pad. The solder joint mechanical integrity was evaluated by solder ball shear test. High temperature storage test was also carried out to evaluate the solder joint reliability. Experiment results showed that Ag pad fabricated by AM is SMT compatible. High temperature storage did not cause early...

... possess a higher melting point than the low temperature semimetal. The paper will demonstrate the use of this technique to make reliable 2D lines and 3D structures. It will also discuss the deposition and sintering process and its effect on the adhesion strength, thermal conductivity, and electrical...

...TWIST RELIABILITY ASSESSMENT OF FLEXIBLE BATTERY IN WEARABLE APPLICATIONS Pradeep Lall(1), Hyesoo Jang(1), Scott Miller(2) (1)Auburn University NSF-CAVE3 Electronics Research Center Department of Mechanical Engineering, Auburn, AL 36849 (2)NextFlex Manufacturing Institute, San Jose, CA Tele: +1(334...

... for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied. HPC data center cloud computing chip module UF encapsulation reliability HIGH PERFORMANCE COMPUTING...

...ADDITIVE FABRICATED COMPLIANT INTERCONNECTS: DESIGN, FABRICATION AND RELIABILITY EFFECTS Tumininu Olatunji Mechanical Engineering University of Arkansas Fayetteville, AR, USA David Huitink, Ph.D. 1 Mechanical Engineering University of Arkansas Fayetteville, AR, USA ABSTRACT Electronics packaging...

... Abstract Additively Printed Flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the location of use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various...

... Abstract Immersion cooling is highly efficient thermal management technique and can potentially be used for thermal management of high-density data. However, to use this as a viable cooling technique, the effect of dielectric coolants on the reliability of server components needs...

... to thermal aging. The proposed method can be used for equivalency of damage accrued in Cu-Al parts subjected to multiple thermal aging environments. Cu-Al wire bond Intermetallic layer Reliability Leading indicators Prognostication Health Management LEADING INDICATORS FOR PROGNOSTICATION...

... 15 02 2012 Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as wire bond. Extensive...