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Keywords: reliability
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Paper No: IPACK2021-74060
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-74060 Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A025, October 26–28, 2021
Paper No: IPACK2021-74199
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-74199 SOLDERABILITY AND RELIABILITY OF SINTERED NANO-AG BOND PADS OF PRINTED RE...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-73367 RELIABLE ADDITIVE MANUFACTURING USING TRANSIENT LIQUID PHASE SINTERING Gilad Nave...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 27–29, 2020
Paper No: IPACK2020-2647
.... With the advancements in portable and densely packaged electronics, thin power sources, which are reliable and are needed to sustain the daily stresses of motion. The ability of thin form factors to operate reliably in presence of loads such twisting while simultaneously being exposed to different ambient temperatures...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
... is studied for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied. HPC data center cloud computing chip module UF encapsulation reliability HIGH...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
...Abstract Abstract Electronics packaging development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical strains occur because of the coefficient of thermal expansion mismatch from different...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Paper No: IPACK2019-6579
... Abstract Additively Printed Flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the location of use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 7–9, 2019
Paper No: IPACK2019-6568
... Abstract Immersion cooling is highly efficient thermal management technique and can potentially be used for thermal management of high-density data. However, to use this as a viable cooling technique, the effect of dielectric coolants on the reliability of server components needs...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A019, July 16–18, 2013
Paper No: IPACK2013-73287
... to thermal aging. The proposed method can be used for equivalency of damage accrued in Cu-Al parts subjected to multiple thermal aging environments. Cu-Al wire bond Intermetallic layer Reliability Leading indicators Prognostication Health Management LEADING INDICATORS FOR PROGNOSTICATION...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Paper No: IPACK2011-52260
... Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as wire bond. Extensive research has been carried...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 75-82, July 6–8, 2011
Paper No: IPACK2011-52264
... A thermo-mechanical analysis is carried out on a stacked die package having through silicon via technology to study the overall reliability of the package due to varying aspect ratio (size and shape) of through silicon vias, silicon die thickness, underfill thickness and underfill material...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Paper No: InterPACK2009-89209
... 07 01 2011 In this work, the effects of underfill cure temperature and JEDEC MSL preconditioning on underfill mechanical and strength properties, as well as flip chip assembly reliability have been explored. Baseline stress-strain curves, mechanical properties, and interfacial shear...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Paper No: InterPACK2009-89337
... 07 01 2011 The LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be solved before gaining more market penetration. With special features of low-junction-temperature and low-cost design, COP (Chip-on-Plate) LED...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 267-276, July 19–23, 2009
Paper No: InterPACK2009-89223
... and, as such, it is particularly useful for development of MEMS , especially while considering MEMS reliability assessment. In fact, this methodology is being used in various manufacturing stages of MEMS for high-performance applications . MEMS emerging technologies optoelectronic methodology operating conditions...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 179-197, July 8–12, 2007
Paper No: IPACK2007-33872
... 12 01 2010 The built-in stress test (BIST) is extensively used for diagnostics or identification of failure. The current version of BIST approach is focused on reactive failure detection and provides limited insight into reliability and residual life. A new approach has been developed...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 873-882, July 8–12, 2007
Paper No: IPACK2007-33687
... a billion. All of the above has necessitated considerable improvement in cooling technology and associated reliability. Heat sinks play an important role in cooling technology by providing an increased surface area to dissipate heat. While there has been a great deal of work related to the thermal...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 101-116, July 8–12, 2007
Paper No: IPACK2007-33876
... 12 01 2010 Methodologies for prognostication and health monitoring can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable. Presently, health monitoring approaches such as the built-in self-test (BIST) are based...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 531-537, July 8–12, 2007
Paper No: IPACK2007-33250
... with fatigue life longer than 1000 cycles, the scatter of the fatigue cycles from 100 to several hundred cycles becomes larger. So, it seems that it is necessary to carefully evaluate the low-cycle fatigue life in the reliability evaluation. Moreover, in large chip components, not only crack initiation...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 67-72, July 8–12, 2007
Paper No: IPACK2007-33850
... lives) in order to guarantee operational reliability. This paper presents a hermetic fluxless die and wafer-level sealing process with adequate bond strength, assessed using the MIL-STD-883E standard. The hermetic sealing process is achieved via 80%Au-20%Sn eutectic solder rectangular seal rings...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 749-756, July 6–11, 2003
Paper No: IPACK2003-35096
... A = C 3 N i −γ are determined. These relationships will enable us to evaluate the lifetime of the solder joints before the initiation of thermal cracks based on observations of microstructural evolution. Solder joint Lead-free solder Thermal fatigue Reliability Phase growth...