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Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
..., and we examined different aspects of their performance in this study. direct-write technique additive printing flexible electronics polyimide substrate copper neural network regression IMC Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging...
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Open the PDF for Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability in another window
Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
... the intermetallics at the interface of conductive adhesive and additively printed circuits. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge gauge factor shear load to failure Proceedings of the ASME 2022 International...
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Open the PDF for Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications in another window
Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
... parameters for microvias for multilayer z-axis interconnections. direct-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive low-temperature solder multilayer process development sintering analysis shear load to failure...
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
Open the PDF for Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment in another window
Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components
Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
https://doi.org/10.1115/IPACK2021-74570
... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...
View Paper titled, Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress
Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
https://doi.org/10.1115/IPACK2021-74073
...-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive process development sintering analysis shear load to failure LC filter Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging...
View Paper titled, Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
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Topics: Adhesives, Filters, Printing, Silver, Sintering
Proceedings Papers

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2664
https://doi.org/10.1115/IPACK2020-2664
..., Dielectric, Polyimide substrate, Additive printing, Resistance, Shear load to failure, Aerosol Jet Printing, Process study NOMENCLATURE Ag Silver NMP N-Methyl-2-Pyrrolidone AJP Aerosol Jet Printing 1 Contact author: lall@auburn.edu 1. INTRODUCTION Printed electronics is gaining traction in a number...
View Paper titled, Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink
Open the PDF for Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink in another window
Topics: Aerosols, Failure, Inks, Nanoparticles, Printing, Shear (Mechanics), Stress
Proceedings Papers

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6579
https://doi.org/10.1115/IPACK2019-6579
... has been acquired under both twist and flex using resistance monitoring. Failure mechanisms have been studied for both deformation modes. polyimide substrate additive printing resistance aerosol jet printing failure reliability flexing twisting FLEXURE AND TWIST TEST RELIABILITY...
View Paper titled, Flexure and Twist Test Reliability Assurance of Flexible Electronics
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Topics: Aerosols, Bending (Stress), Flexible electronics, Reliability