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Keywords: open compute servers
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 7–9, 2019
Paper No: IPACK2019-6602
... fluids to reduce the operational and cooling costs by enhancing the thermal management of servers. This research work aims at increasing the rack density by reducing the form factor of a 3 rd Generation Open Compute Server using single-phase immersion cooling. A computational study is conducted...
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 7–9, 2019
Paper No: IPACK2019-6600
... of successive heat sink and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling. In this study, the impact of thermal shadowing in a third-generation open compute server using different dielectric fluids is compared. The heat sink is a critical part for cooling...