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Keywords: multi-scale
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Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 521-527, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35297
... data center multi-scale thermal characterization Data center facilities, which house thousands of servers, storage devices and computing hardware, arranged in 2 meter high racks are providing many thermal challenges. Each rack can dissipate 10–15 kW, and with facilities as large as tens...
