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Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 203-208, July 6–11, 2003
Paper No: IPACK2003-35336
... Buried resistors co-firing thick films miniaturization The complexity and performance of the electronic components and systems is increasing and placing greater demands on compact packaging and interconnection technologies. Multilayer thick film technology is one of the important...