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Keywords: mechanical properties
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97453
... stress or strain has been recorded and discussed. electronic packaging reliability EMC mechanical properties fatigue long term aging high temperature Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A024, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74076
... modulus and glass transition temperature are extracted from the results of dynamic loading tests. The aging effect of linear viscoelasticity has been discussed. electronic packaging reliability underfill mechanical properties long term aging high temperature Proceedings of the ASME 2021...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69719
... finding use in in electronic products. This paper provides a preliminary evaluation of the mechanical behavior of HAFs. Two commercial polyurethane HAF formulations (designated as HAF-II and HAF-III, for the purpose of this paper) were evaluated to assess the dependence of the mechanical properties...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2677
..., 90days, 120 days and 240 days. The research focuses on microstructure-property-processing-performance relationships, building the relation between the microstructure evolution and macro-mechanical properties. Reliability physics of high temperature degradation of packaging material is studied...
