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Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

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Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
... with surface mount components and their response under sustained temperature exposure has been studied. inkjet low pass filter high pass flexible printed electronics Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic...
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat