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1-20 of 29
Keywords: liquid cooling
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Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141206
... Abstract Applying cold plates to primary heat sources of high-performance compute (HPC) or Artificial Intelligence (AI) servers and pumping refrigerant through them is known as pumped two-phase (P2P) liquid cooling. Refrigerant to air (RA) and refrigerant to liquid (RL) versions of P2P direct...
Proceedings Papers
Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
... pathways, and the absence of elevated floors in many older DCs. In response to these limitations, liquid-to-air (L2A) cooling distribution units (CDUs) have emerged as an alternative method. By incorporating hybrid air and liquid cooling technologies, the industry aims to achieve precise, on-demand cooling...
Proceedings Papers
Ali Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
... study thoroughly evaluates a two-phase direct-to-chip liquid cooling system’s ability to effectively manage and dissipate heat in high-density rack environments. Central to our research is the deployment of a highly efficient Refrigerant-to-Liquid (R2L) Coolant Distribution Unit (CDU) across multi-racks...
Proceedings Papers
Yousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
... Abstract Liquid cooling technology is experiencing rapid acceptance in high-speed computing and data centers, driven by the remarkable advancements in these sectors that have resulted in unprecedented increase in thermal loads that are anticipated to surpass the capabilities of single-phase...
Proceedings Papers
Yunhyeok Im, Junyoung Kim, Mingeun Choi, Myriam Bouzidi, Xingchen Li, Joon Woo Kim, Ahmet Mete Muslu, Satish Kumar, Madhavan Swaminathan, Suresh K. Sitaraman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141216
... the external cooling environment in the early design stage. thermal design heterogeneous integration 2.5D package silicon interposer glass substrate thermal violation region graph liquid cooling high-power package Proceedings of the ASME 2024 International Technical Conference and Exhibition...
Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
... of traditional air-cooling methods. Many high-performance server systems currently available in the market require liquid cooling due to their high power and power densities. Liquid cooling technologies provide a more efficient means of dissipating heat from high-power density chips and, in certain cases, can...
Proceedings Papers
Ali Heydari, Harold Miyamura, Uschas Chowdhury, Yaman Mohammad Ali Manaserh, Mohammad Tradat, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Dwayne Kalma, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
... Abstract High-performance computing with the latest generation of high-density chips and microprocessors in data centers requires advanced and efficient cooling technology to meet the challenging thermal requirements. Indirect liquid cooling with cold plates on top of the processor has become...
Proceedings Papers
Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110587
... advanced cooling technologies, need to be investigated. Liquid cooling is becoming more mainstream to overcome the some of challenges mentioned above. Direct-to-chip cold plate-based liquid cooling is highly efficient and becoming more reliable as the advancement in technology is taking place. Several...
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
..., which are nearing their limitations. Single-phase liquid cooling methods have proven to be reliable, usable, and energy-efficient methods for cooling high-heat flux devices. With the introduction of packages with multiple-chip modules (MCMs), the cold plates of future generations are expected to handle...
Proceedings Papers
Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
... for online services, which has also led to an increase in the amount of waste heat generated by IT equipment. Through the implementation of hybrid air and liquid cooling technologies, targeted, on-demand cooling is made possible by employing a variety of techniques, which include but are not limited...
Proceedings Papers
Ali Heydari, Bahareh Eslami, Uschas Chowdhury, Vahideh Radmard, Pardeep Shahi, Harold Miyamura, Mohammad Tradat, Peter Chen, Drew Tuholski, Kevin Gray, Tyler Buell, Greg Stover, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111959
... been changed. Both air and hybrid (air-liquid) cooling are examined and for the liquid-cooled section, liquid-to-liquid (L2L), and liquid-to-air (L2A) coolant distribution units (CDU) are assessed at two levels of rack and row scale. Total Usage Effectiveness (TUE) and Total Cost of Ownership (TCO...
Proceedings Papers
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
... Abstract The rising demand for high-performance central and graphical processing units has resulted in the need for more efficient thermal management techniques like direct-to-chip liquid cooling. Direct Liquid Cooling using cold plates is one of the most efficient and investigated cooling...
Proceedings Papers
Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97443
... Abstract Direct to chip liquid-cooling technique has been widely implemented for the cooling of processors with high thermal design power. To further enhance the efficiency of liquid cooling, ongoing research focuses on the optimizations at the cold plate level or by changing the flow...
Proceedings Papers
Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
... Abstract Cold plates are at the heart of pumped liquid cooling systems. In this paper, we report on combined experimental, analytical, and computational efforts to characterize and model the thermal performance of advanced cold plates in order to establish their performance limits. A novel...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96972
... Abstract Due to continuous growth of AI accelerator chip power and heat flux, implementation of advanced cooling technologies for AI platforms seems to be inevitable for hyper scale users. Liquid cooling is one of the relatively more mature category of advanced cooling technologies, and has...
Topics:
Cooling
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97476
... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...
Proceedings Papers
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97425
... Abstract Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most efficient...
Proceedings Papers
Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97445
... Abstract Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower thermal resistance path from the chip...
Proceedings Papers
Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
.... A gradual transition from 100% air cooling to 25%–75% air and liquid cooling has been studied to capture the changes in IT, fan, facility, and the total data center power consumption. Various system design optimizations such as supply air temperature (SAT), facility chiller water temperature, economization...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73283
... Abstract Impingement split flow liquid-cooled microchannel cold plates are one of several flow configurations used for single-phase liquid cooling. Split flow or top-in/side-exit (TISE) cold plates divide the flow into two branches thus resulting in halved or reduced flow rates and flow lengths...
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