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Proceedings Papers

Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions

P. Kumar, Z. Huang, I. Dutta, R. Mahajan, M. Renavikar, R. Sidhu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 389-396, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89205
https://doi.org/10.1115/InterPACK2009-89205
... of solder microstructure and interfacial intermetallic compound (IMC) layer thickness on the joint fracture toughness at different mode-mixities and strain rates. Modified compact mixed mode (CMM) samples with adhesive solder joints between Cu plates and a thin film interfacial starter crack were used...
View Paper titled, Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions
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Topics: Dynamic testing (Materials), Fracture (Materials), Solder joints, Solders, Tin