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Keywords: inkjet
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
... FUNCTIONAL CIRCUITS WITH WATER-BASED SILVER INK ON AN INKJET PLATFORM Pradeep Lall Auburn University, NSF-CAVE3 Electronics Research Center, Department of Mechanical Engineering Auburn, AL 36849 E-mail: [email protected] Tele: +1(334)844-3424 Shriram Kulkarni Auburn University, NSF-CAVE3 Electronics Research...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
...Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023, San Diego, California IPACK2023-111980 LINE WIDTH AND ELECTRICAL PERFORMANCE PREDICTION FOR INKJET PRINTED...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111979
... ADHESIVE AND MAGNETICALLY ORIENTED ANISOTROPIC CONDUCTIVE ADHESIVE ON INKJET PRINTED STRUCTURES Pradeep Lall Auburn University NSF-CAVE3 Electronics Research Center, Department of Mechanical Engineering Auburn, AL 36849 E-mail: [email protected] Tele: +1(334)844-3424 Shriram Kulkarni Auburn University NSF...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
... inkjet low pass filter high pass flexible printed electronics Abstract In this paper, the Inkjet printing technique is utilized to characterize the printed circuit performance with surface mount components when exposed to 50°C temperature. Functional circuits such as low pass and high...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
... inkjet DOE prediction ANOVA flexible printed electronics Abstract In this paper, predictive models are developed for inkjet printed features regarding their electrical and mechanical performance and to help reduce the initial process time in selecting print parameters. Printed...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74063
... inkjet Konica Minolta copper ink photonic sintering printed electronics control chart Abstract Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1935-1941, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73186
... The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand (DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol...