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Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

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Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
... Abstract In this paper, the Inkjet printing technique is utilized to characterize the printed circuit performance with surface mount components when exposed to 50°C temperature. Functional circuits such as low pass and high pass filters are printed, and their frequency performance is studied...
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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat